SAMSUNG Confidential
MODEL
LSC460HJ03
Doc. No
Page
31 / 42
10. Special precautions
10.1 Lists to be cautious when executing the design process
No.
Component
Expected cause
1 Upholding part for
panel
Prevent the panel from breaking by assigning gaps between the panel and the upholding part for panel on the drawing
for the upholding part for panel.
Refer to the (a), (b), (c) of 3-1 for the design of BLU.
2
The shape of the
upholding part for
panel
Design the upholding part for panel to fit to the panel appropriately when designing the BLU since the shape of the
upholding part for panel may damage the panel.
Refer to the (a), (b), (c) of 3-1 for the design of BLU.
3
The edge of
upholding part for
panel
Design the edge of panel to have a sufficient space with the upholding part for panel when designing the BLU since the
edge of the upholding part for panel may damage the panel when assembling the panel and BLU.
Refer to the (a), (b), (c) of 3-1 for the design of BLU.
4 Upholding part for
panel
Place the upholding part for the panel in order for the shape of mold, which contacts with the panel not to interfere with
the area of panel.
Refer to the (a), (b), (c) of 3-1 for the design of BLU.
5
Drive IC
Design the BLU in order for the COF not to contain the lead crack resulted from the tensioned COF created when the
product is twisted if the space between the D-IC COF and the middle mold isn't sufficient.
Refer to the (a), (b), (c),(d),(e),(f), and (g)of 3-2 for the design of BLU.
6
Drive IC
Design the BLU in order for the product not to contain the lead crack resulted from the tensioned COF caused under the
condition, which the product is twisted by fixing the source PCB.
Refer to the (a), (b), (c),(d),(e),(f), and (g)of 3-2 for the design of BLU.
7
IC
component
1) The temperature of each part of product suggested by our company and the second vendor shall meet the standard
of temperature, which is recommended not to be exceeded by our company when the product is affected under the
various temperature ranges.
Apply over 1mm long separation distance stated in the safety standard between the electric part and each conductor.
(Apply the rated separation distance when insulating.)
8 Thermal pad
Apply the thermal pad in a designated size to the product as a measure to lower the temperature of heat in order for
each part to use the rated temperature.
9
POL
The surrounding area of the POL shall be treated with an electrification treatment since the external ESD may cause a
phenomenon, which the POL is coming off.
In addition, the GND portion of source PBA shall be grounded.
10
PBA
The GND portion of each PBA shall be contacted with the GND portion of BLU.
Refer to the (a) and (b) of 3-3 for the design of BLU.
11
Circuit
The standardized approval from the client is required since the EMI is executed by a client.
Our company can only measure the reference since the client measures the BLU.
12
The height of
component
Design the BLU with considering the maximum height of parts, which our company suggests.
13 Between the FFC
and the C-PBA
Design the instrument with considering the length between the FFC and the control PBA.
(The marginal minimum length of 5mm or 8mm is required.)
14
Panel
The surface temperature of panel shall be maintained within 0℃ and 45℃ when the external ambient temperature is at
25℃.
(Design the BLU with considering the increase of the temperature in the panel by the LED, CCFL, and etc.)
15
Aging
Recommend to age for over 1 hour at least in the state, which the product is driving initially to stabilize the characteristic
of the initial TFT.
16 The attachment of
gasket
The additional confirmation by our company is required If the attachment of gasket to the S-PBA of our company is
required.(To fix the S-PBA or the EMI)
17
Drive IC
Design the top chassis and the driver IC to be contacted by placing the shape of emboss inside the top chassis as a
measure to prevent the driver IC from heating. The size of emboss shall be designed in larger size than the size of IC
inside the film of the driver IC.
Refer to the (a), (b), (c),(d),(e),(f), and (g)of 3-2 for the design of BLU.
18 The prohibited
bandwidth
Design the BLU in order for the BLU not to interfere with the area, where the control PBA and the source PBA are
located densely according to the drawing for the BLU from our company.
19
S-PBA
The material, which contacts with the bottom side of S-PBA which has a pattern shall be non-conducting material or
shall be insulated.
