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Samsung LSC460HJ03, Manual

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                             SAMSUNG Confidential   

MODEL 

LSC460HJ03 

Doc. No 

 

Page 

25 / 42 

 

7. Outline dimension   

 
7.1 The adhesive size of POL   
The next figure shows the size of POL on the drawing sheet attached to the panel for BLU design. 

 

<Figure.> 

The POL size of CF : 1029.28 X 586.25 ±0.2mm   
The POL size of TFT: 1028.88 X 586.25 ±0.2mm   
The total adhesion allowance of POL is  ±0.8

㎜

(L/R),  ±1.15

㎜

(U/D) 

7.2    The drawing sheet for the size of the OLB bonding

 

 

 

Summary of Contents for LSC460HJ03

Page 1: ...3 Doc No Page 1 42 SAMSUNG TFT LCD MODEL LSC460HJ03 LCD Panel Driver Ass y Kit The Information described in this specification is for the first draft and can be changed without prior notice Customer DATE 23 Nov 2012 Samsung Display Co LTD ...

Page 2: ...nd Gray Scale of Each Color 6 Interface 19 6 1 Timing Parameters DE only mode 6 2 Characteristics of LVDS Input data 6 3 Timing Diagrams of interface Signal DE only mode 6 4 Power ON OFF Sequence 7 Outline Dimension 23 7 1 The adhesive size of POL 7 2 The drawing sheet for the size of the OLB bonding 7 4 Cross Section of cell 7 5 Source PCB 7 6 FFC cable 7 7 Control PCB 8 Reliability Test 24 9 Gen...

Page 3: ...SAMSUNG Confidential MODEL LSC460HJ03 Doc No Page 3 42 Date Rev No Page Summary 23 Nov 2012 000 all First Issue First Draft The revision history ...

Page 4: ...ition TV General Information Features RoHS compliance Pb free High contrast ratio aperture ratio with the wide color gamut SVA Super Vertical align mode Wide viewing angle 178 High speed response FHD resolution 16 9 Low power consumption DE Data enable mode The interface 2pixel clock of 2ch LVDS Low voltage differential signaling Items Specification Unit Note Active Display Area 1018 08 H x 572 67...

Page 5: ...erature TOPR 0 50 2 5 Humidity for storage HSTG 5 95 RH 2 4 Operating humidity HSTG 20 95 RG 2 5 Endurance on static electricity 150 V 3 Note 1 The power supply voltage at Ta 25 2 C 2 Temperature and the range of relative humidity are shown in the figure below a 95 RH Max Ta 39 C b The relative humidity is 90 or less Ta 39 C c No condensation d Operating condition with SET 3 Keep the static electr...

Page 6: ...le TBD TBD cd m 2 VD BLU 4 SR 3 Chromaticity CIE 1931 Red Rx TYP 0 03 0 640 TYP 0 03 VD BLU 5 6 SR 3 Ry 0 330 Green Gx 0 300 Gy 0 600 Blue Bx 0 150 By 0 060 White Wx 0 280 Wy 0 290 sRGB Concordance 99 5 SR 3 Color gamut 72 VD BLU Color 7 000 10 000 K Viewing Angle Hor qL C R 10 75 89 Degree Standard or VD BLU 6 SR 3 EZ Contrast qR 75 89 Ver qU 75 89 qD 75 89 Brightness uniformity 9 Points Buni TBD...

Page 7: ... color is Wx 0 313 Wy 0 329 The luminance of this product is 7217cd Photo detector Field SR 3 2 1 RD 80S 1 c The CIE positions D65 as the standard daylight illuminant D65 is intended to represent average daylight and has a correlated color temperature of approximately 6500 K CIE standard illuminant D65 should be used in all colorimetric calculations requiring representative daylight unless there a...

Page 8: ...lue that was measured after it was operated in Samsung s standard BLU for one hour at room temperature Note 4 The definition of luminance of white The luminance of white at the center point The measurement shall be executed with the standard light source of D65 Note 5 The definition of chromaticity CIE 1931 The color coordinate of red green blue and white at the center point The measurement shall ...

Page 9: ...e measurement shall be executed with the standard light source of D65 Tmax The maximum Transmissivity Tmin The minimum Transmissivity Note 9 Management Criteria of Gamma Value Note 10 5nit Low Gray Uniformity Tuni 100 𝑻𝒎𝒂𝒙 𝑻𝒎𝒊𝒏 𝑻𝒎𝒂𝒙 Gamma Value 20 200Gray 2 2 0 2 Buni_5nit 100 𝐵𝑚𝑎𝑥_5𝑛𝑖𝑡 𝐵𝑚𝑖𝑛_5𝑛𝑖𝑡 𝐵𝑚𝑎𝑥_5𝑛𝑖 𝑡 Bmax_5nit The maximum brightness at 5nit Gray Bmin_5nit The minimum brightness at 5nit Gray...

Page 10: ...asured at P 5 Note 12 Management Criteria of ACC Linearity Note 13 White Color Coordinate Uniformity of 9 points Test pattern The full white 255Gray Wx Wy value basis a module unit basis a Color coordinate differences are less than 15 1 000 at Any Point above 30Gray and 255Gray b When Wx Wy coordinates reverse at 0Gray it permits an once intersection under 30Gray Wx uni Wx max Wx min Wx max The ma...

Page 11: ...pply a Black IDD 1 000 1 200 mA 2 3 b White 1 000 1 200 mA c Sub V Stripe 1 400 1 800 mA Vsync frequency fV 60 Hz Hsync frequency fH 67 5 kHz Main frequency Fdclk 148 5 MHz 2pixels clk Rush current IRUSH 3 A 4 Note 1 The ripple voltage should be controlled fewer than 10 of VDD Typ voltage 2 fV 120Hz fDCLK 297MHz VDD 12 0V DC Current 3 Power dissipation check pattern LCD Module only 4 Conditions fo...

Page 12: ...SAMSUNG Confidential MODEL LSC460HJ03 Doc No Page 12 42 4 Block diagram ...

Page 13: ...6 No connection 31 GND 7 GND 32 RECLK 8 GND 33 RECLK 9 GND 34 GND 10 Odd LVDS Signal RO 0 N 35 RE 3 N 11 RO 0 P 36 RE 3 P 12 RO 1 N 37 RE 4 N 13 RO 1 P 38 RE 4 P 14 RO 2 N 39 GND 15 RO 2 P 40 No connection NOTE1 16 GND 41 No connection 17 ROCLK 42 No connection 18 ROCLK 43 No connection 19 GND 44 No connection 20 RO 3 N 45 No connection 21 RO 3 P 46 No connection 22 RO 4 N 47 No connection 23 RO 4...

Page 14: ...e left side a Power GND pins should be connected to the LCD s metal chassis b All power input pins should be connected together c All NC pins should be separated from other signal or power Note 2 Aging Enable PIN IF this Pin GND BIST MODE Rolling Pattern is operated Fig The diagram of connector ...

Page 15: ...xIN RxOUT7 G2 G0 TxOUT RxIN1 TxIN RxOUT8 G3 G1 TxIN RxOUT9 G4 G2 TxIN RxOUT12 G5 G3 TxIN RxOUT13 G6 G4 TxIN RxOUT14 G7 G5 TxIN RxOUT15 B2 B0 TxIN RxOUT18 B3 B1 TxOUT RxIN2 TxIN RxOUT19 B4 B2 TxIN RxOUT20 B5 B3 TxIN RxOUT21 B6 B4 TxIN RxOUT22 B7 B5 TxIN RxOUT24 HSYNC HSYNC TxIN RxOUT25 VSYNC VSYNC TxIN RxOUT26 DEN DE TxOUT RxIN3 TxIN RxOUT27 R0 R6 TxIN RxOUT5 R1 R7 TxIN RxOUT10 G0 G6 TxIN RxOUT11 G...

Page 16: ... 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R2 R3 R252 1 0 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R253 0 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R254 RED 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R255 GRAY SCALE OF GREEN BLACK 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 G0 DARK LIGHT 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 G1 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 G2 G3 ...

Page 17: ...T13 G6 G4 TxIN RxOUT14 G7 G5 TxIN RxOUT15 B2 B0 TxIN RxOUT18 B3 B1 TxOUT RxIN2 TxIN RxOUT19 B4 B2 TxIN RxOUT20 B5 B3 TxIN RxOUT21 B6 B4 TxIN RxOUT22 B7 B5 TxIN RxOUT24 HSYNC HSYNC TxIN RxOUT25 VSYNC VSYNC TxIN RxOUT26 DEN DE TxOUT RxIN3 TxIN RxOUT27 R0 R6 TxIN RxOUT5 R1 R7 TxIN RxOUT10 G0 G6 TxIN RxOUT11 G1 G7 TxIN RxOUT16 B0 B6 TxIN RxOUT17 B1 B7 TxIN RxOUT23 RESERVED RESERVED TxOUT RxIN4 dithere...

Page 18: ...0 0 0 0 0 R2 R3 R1020 1 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R1021 0 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R1022 RED 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R1023 GRAY SCALE OF GREEN BLACK 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 G0 DARK LIGHT 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 G1 0 0 0 0 0 0 0...

Page 19: ...y period THD 1920 Clocks Total Horizontal TH 2200 clocks Note These products don t have to receive the signal of Hsync Vsync from the input device 1 Key points when testing TTL controls the signal and the CLK at the input terminal of LVDS Tx of the system 2 Internal VDD 3 3V 3 Spread spectrum The limit of spread spectrum s range of SET in which the LCD module is assembled should be within 3 TxOUT ...

Page 20: ...SAMSUNG Confidential MODEL LSC460HJ03 Doc No Page 20 42 6 2 Timing diagrams of interface signal Only DE mode ...

Page 21: ...reshold voltage VTH 100 mV VCM 1 2V Differential input low threshold voltage VTL 100 mV Input common mode voltage VCM 0 3 1 2 21 8 V Differential Input Voltage VID 100 350 600 mV VID 100mV Input data position FIN 80MHz tRSRM 400 ps tRSLM 400 ps Notice The spread spectrum should be 0 when the skew is measured Position of a measurement is T CON LVDS input pin ...

Page 22: ...hskw 16 LVDS Clock Period LVDS Clock to Data Skew TRSRM TRSLM at each LVDS Channel Symbol Characteristics Min Typ Max Unit TRSRM Input Data Position LVDS CLK 85MHz 400 ps LVDS CLK 78MHz 450 ps LVDS CLK 75MHz 500 ps TRSLM Input Data Position LVDS CLK 85MHz 400 ps LVDS CLK 78MHz 450 ps LVDS CLK 75MHz 500 ps RINCLK LVDS CLK RIN LVDS Data Rx Internal Strobe Window TRSRM TRSLM RIN LVDS Data ...

Page 23: ...age when the power is off T4 the time from the point which the Vdd decrease to the point which the Vdd increase again for windows to restart The recommended operating condition of the back light system T5 The time which takes for B L to be turned on after the signal is entered when the time is on T6 The time which takes until the signal is out after BL is turned off The condition of supply voltage...

Page 24: ...ase keep the level of input signals low or keep a high impedance condition The figure of T4 should be measured after the module has been fully discharged between the periods when the power is on and off The interface signal must not keep the high impedance condition when the power is on ...

Page 25: ... POL The next figure shows the size of POL on the drawing sheet attached to the panel for BLU design Figure The POL size of CF 1029 28 X 586 25 0 2mm The POL size of TFT 1028 88 X 586 25 0 2mm The total adhesion allowance of POL is 0 8 L R 1 15 U D 7 2 The drawing sheet for the size of the OLB bonding ...

Page 26: ...s 2hr drop 20cm 1pallet WHTS 60 75 RH Storage 4 Noise Electromagnetic noise Overall 23dB 이하 2 Complex stress 20 60 0 90 RH 2cycle 4 ESD S IC Input 7KV Output 4KV Output 은 data TP 에 직접 인가 후 진행 Input 은 CKV VCOM 등에 FFC CNT 를 통하여 TEST 를 진행 3 EOS optional Item Test condition Vin Input step Surge combination High impedance Pass Condition 5kV under Signal Input step Surge combination High impedance Pass ...

Page 27: ...e and etc f Note that polarizer could be damaged easily Do not press or scratch the bare surface with the material which is harder than a HB pencil lead g Wipe off water droplets or oil immediately If you leave the droplets for a long time on the product a staining or the discoloration may occur h If the surface of the polarizer is dirty clean it using the absorbent cotton or the soft cloth i Desi...

Page 28: ...eled off just before using so that the electrostatic charge can be minimized s The panel kit and BLU kit have high frequency circuits The sufficient suppression to the EMI should be done by the set manufacturers t The set of which the panel is assembled shall not be twisted If the product is twisted it may cause the damage on the product u Surface Temp of IC should be controlled less than 100 oper...

Page 29: ...h may damage the electric device 6 Don t store the product at the location surrounded by dangerous factors which can deteriorate the quality of product 9 3 Operation a Do not connect or disconnect the FFC cable during the Power On condition b Power supply should be always turned on and off by the Power on off sequence c The module has high frequency circuits The sufficient suppression to the elect...

Page 30: ...markets and controlling systems 9 5 Others a The ultra violet ray filter is necessary for the outdoor operation b Avoid the condensation of water which may result in the improper operation of product or the disconnection of electrode c Do not exceed the limit on the absolute maximum rating For example the supply voltage variation the input voltage variation the variation in content of parts and en...

Page 31: ...ted separation distance when insulating 8 Thermal pad Apply the thermal pad in a designated size to the product as a measure to lower the temperature of heat in order for each part to use the rated temperature 9 POL The surrounding area of the POL shall be treated with an electrification treatment since the external ESD may cause a phenomenon which the POL is coming off In addition the GND portion...

Page 32: ...SAMSUNG Confidential MODEL LSC460HJ03 Doc No Page 32 42 11 Example The length between the FFC and the C PBA The grounding of PCB ...

Page 33: ...tial MODEL LSC460HJ03 Doc No Page 33 42 Appendix2 Recommendation for the BLU Design The Information described in this specification is for the first draft and can be changed without prior notice Samsung Display Co LTD ...

Page 34: ...SAMSUNG Confidential MODEL LSC460HJ03 Doc No Page 34 42 1 The schematic of panel Item Symbol Remark Protector Film Removable Polaroid Film Color Filter Glass TFT Glass Source IC Gate IC Source PBA FFC ...

Page 35: ...cture should be considered when you design The shrinkage under the situation which the temperatures change causes the light leakage For your reference it is recommended to have a total gap between the panel and the guide structure as below When the resin is composed of the PC and the 15 of G F tꀀሄ 32 40 46 55 Total Gap Right Left 0 9 0 9 1 0 1 1 Top Bottom 0 6 0 7 0 8 0 9 It is recommended to foll...

Page 36: ...ge with the unstable design can be easily happened under the external force The sharp or the round shape near the panel shall be changed to a flat shape such as the shape of screw point the gate point and etc It is recommended to keep the gap between the panel guides and ribs over 1mm in the worst conditions The suggested dimension does not guarantee the quality of the products The gap between the...

Page 37: ... of mold or the parting line in the position of COF when designing the product b It is recommended to secure the sufficient gap between the COF and the other parts when designing the product since the lack of gap between the COF and the other parts can cause the damage in the COF such as the lead crack under the condition which the product is twisted The space over 3 0mm for moving is recommended ...

Page 38: ...event the damage on Drive IC from the external force If the panel is placed to the upper part of the mold it is recommended to keep the gap between the mold and the front cover or the mold and the top chassis by adding the rib between the COF and COF Design the gap between the rib and the cover to maintain the space for the protection of COF as small as possible ...

Page 39: ...tic electricity f If the length of COF is designed to be short the lead crack can be occurred by applying the tension on the COF due to the being shaking of the product g It is recommended to design source PCB can be easily moved to the direction of each axis in order for the tension not to be applied to the edge of COF under vibrating condition such as transportation of the product ...

Page 40: ...rical parts by the static electricity and the external forces If the material of shielding part is metal the insulation method is recommended b Confirm the status of insulation tape since the inappropriately attached insulation tape can cause the damage on the parts of product if the insulation tape for the insulation of part of PBA is attached inconsecutively due to the inappropriate design or th...

Page 41: ...od delineated in the picture below for designing since the distortion on panel and the sharp increase of the temperature gradient in the surface of panel can cause the light leakage Place the strong beads at the corner point to control the flatness of the panel The heat sinking plane in the lower parts shall contact with the bottom chassis ...

Page 42: ...ies in the screen if the model is the reversed product which has the source PBA designed at the 90 b The deterioration of crystal liquid It is recommended to design the products to make the temperature of the active area of the product operated below the 50 for the protection from containing the abnormalities in the screen due to the deterioration of the liquid crystal In addition it is recommende...

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