Samsung DDR3 Product Manual Download Page 6 | Manualshive

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December 2008

General Information

DDR3 SDRAM

240Pin DDR3 Registered DIMM

Org.

Density

Part Number

Speed

Composition

Comp.

Version

Internal

Banks

Rank

PKG

Height

Avail.

Note

128Mx 72

1GB

M393B2873DZ1

CF7/F8/H9

128M x 8 * 9 pcs

1Gb

D-die

8

1

78 + 4 ball

FBGA

30mm

Now

M393B2873EH1

CF7/F8/H9

128M x 8 * 9 pcs

1Gb

E-die

1

78 ball

FBGA

Now

256Mx 72

2GB

M393B5673DZ1

CF7/F8/H9

128M x 8 * 18 pcs

1Gb

D-die

2

78 + 4 ball

FBGA

Now

M393B5673EH1

CF7/F8/H9

128M x 8 * 18 pcs

1Gb

E-die

2

78 ball

FBGA

Now

M393B5670DZ1

CF7/F8/H9

256M x 4 * 18 pcs

1Gb

D-die

1

78 + 4 ball

FBGA

Now

M393B5670EH1

CF7/F8/H9

256M x 4 * 18 pcs

1Gb

E-die

1

78 ball

FBGA

Now

512Mx 72

4GB

M393B5173DZ1

CF7/F8

128M x 8 * 36 pcs

1Gb

D-die

4

78 + 4 ball

FBGA

Now

M393B5173EH1

CF7/F8

128M x 8 * 36 pcs

1Gb

E-die

4

78 ball

FBGA

Now

M393B5170DZ1

CF7/F8/H9

256M x 4 * 36 pcs

1Gb

D-die

2

78 + 4 ball

FBGA

Now

M393B5170EH1

CF7/F8/H9

256M x 4 * 36 pcs

1Gb

E-die

2

78 ball

FBGA

Now

1Gx 72

8GB

M393B1G70DJ1

CF7/F8

DDP

512M

x 4 * 36 pcs

1Gb

D-die

4

78 ball

FBGA

Now

M393B1G70EM1

CF7/F8

DDP

512M

x 4 * 36 pcs

1Gb

E-die

4

78 ball

FBGA

1Q’09

M393B1K73BH1

CF7/F8

256M x 8 * 36 pcs

2Gb

B-die

4

78 ball

FBGA

Now

M393B1K70BH1

CF7/F8/H9

512M x 4 * 36 pcs

2Gb

B-die

2

78 ball

FBGA

Now

2Gx 72

16GB

M393B2K70BM1

CF7/F8

DDP

1G

x 4 * 36 pcs

2Gb

B-die

4

78 ball

FBGA

1Q’09

240Pin DDR3 VLP Registered DIMM

Org.

Density

Part Number

Speed

Composition

Comp.

Version

Internal

Banks

Rank

PKG

Height

Avail.

Note

128Mx 72

1GB

M392B2873DZ1

CF7/F8/H9

128M x 8 * 9 pcs

1Gb

D-die

8

1

78 + 4 ball

FBGA

18.75mm

Now

M392B2873EH1

CF7/F8/H9

128M x 8 * 9 pcs

1Gb

E-die

78 ball

FBGA

Now

256Mx 72

2GB

M392B5673DZ1

CF7/F8/H9

128M x 8 * 18 pcs

1Gb

D-die

2

78 + 4 ball

FBGA

Now

M392B5673EH1

CF7/F8/H9

128M x 8 * 18 pcs

1Gb

E-die

78 ball

FBGA

Now

M392B5670DZ1

CF7/F8/H9

256M x 4 * 18 pcs

1Gb

D-die

1

78 + 4 ball

FBGA

Now

M392B5670EH1

CF7/F8/H9

256M x 4 * 18 pcs

1Gb

E-die

78 ball

FBGA

Now

512Mx 72

4GB

M392B5170DJ1

CF7/F8/H9

DDP

512M

x 4 * 18 pcs

1Gb

D-die

2

78 ball

FBGA

Now

M392B5170EM1

CF7/F8/H9

DDP

512M

x 4 * 18 pcs

1Gb

E-die

78 ball

FBGA

1Q’09

M392B5273BH1

CF7/F8/H9

256M x 8 * 18 pcs

2Gb

B-die

2

78 ball

FBGA

Now

M392B5270BH1

CF7/F8/H9

512M x 4 * 18 pcs

2Gb

B-die

1

78 ball

FBGA

Now

1Gx 72

8GB

M392B1K73BM1

CF7/F8

DDP

512M

x 8 * 18 pcs

2Gb

B-die

4

78 ball

FBGA

1Q’09

M392B1K70BM1

CF7/F8/H9

DDP

1G

x 4 * 18 pcs

2Gb

B-die

2

78 ball

FBGA

1Q’09

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Summary of Contents for DDR3

Page 1: ...December 2008 General Information DDR3 SDRAM DDR3 SDRAM Product Guide December 2008 Memory Division...

Page 2: ...UNG Memory Interface VDD VDDQ Package Type Temp Power 1 2 3 4 5 6 7 8 9 10 11 Speed B DDR3 SDRAM Commercial Temp 0 C 85 C Normal Power Commercial Temp 0 C 85 C Low Power Commercial Temp 0 C 85 C Low V...

Page 3: ...ll FBGA Now K4B1G0846E HC L F7 F8 H9 K0 128M x 8 K4B1G1646E HC L F7 F8 H9 K0 64M x 16 96 ball FBGA 2Gb B die 8Banks K4B2G0446B HC L F7 F8 H9 512M x 4 78 ball FBGA Now K4B2G0846B HC L F7 F8 H9 256M x 8...

Page 4: ...nks in comp Interface 3 DDR3 SDRAM Module Ordering Information 1 1st Rev 3 3rd Rev C L Y Commercial Temp 0 C 85 C Normal Power Commercial Temp 0 C 85 C Low Power Commercial Temp 0 C 85 C Low VDD 1 35V...

Page 5: ...die 78 ball FBGA Now 256Mx 72 2GB M391B5673DZ1 F8 H9 128M x 8 18 pcs 1Gb D die 78 4 ball FBGA Now M391B5673EH1 F8 H9 K0 128M x 8 18 pcs 1Gb E die 78 ball FBGA Now 512Mx 64 4GB M378B5273BH1 F8 H9 256M...

Page 6: ...GA 1Q 09 M393B1K73BH1 CF7 F8 256M x 8 36 pcs 2Gb B die 4 78 ball FBGA Now M393B1K70BH1 CF7 F8 H9 512M x 4 36 pcs 2Gb B die 2 78 ball FBGA Now 2Gx 72 16GB M393B2K70BM1 CF7 F8 DDP 1G x 4 36 pcs 2Gb B di...

Page 7: ...1 CH9 0849 5 RDIMM RCD Information 1 RCD Identification in JEDEC Description in Module Label 2 Label Example 3 RCD Information Example Vendor Revision Module P N JEDEC Description On Label Inphi B2 M3...

Page 8: ...RK B A 11 00 0 10 J K L 0 80 0 80 Post Reflow 0 05 0 05 0 95 1 90 Bottom Top Bottom Top A1 9 00 0 10 11 00 0 10 0 10MAX 0 50 0 05 1 10 0 10 0 35 0 05 A B C D E F G H J L M N P R T 9 00 0 10 4 00 0 80...

Page 9: ...11 00 0 10 J K L 0 80 0 80 Post Reflow 0 05 0 05 0 95 1 90 Bottom Top Bottom Top A1 7 50 0 10 11 00 0 10 0 10MAX 0 50 0 05 1 10 0 10 0 35 0 05 A B C D E F G H J L M N P R T 7 50 0 10 6 00 Datum B Dat...

Page 10: ...BOTTOM VIEW 11 50 0 10 J K L 0 80 0 80 Post Reflow 0 50 0 05 0 95 1 90 0 10MAX 1 10 0 10 A1 9 00 0 10 11 50 0 10 0 35 0 05 TOP VIEW A B C D E F G H J L M N P R T 9 00 0 10 3 60 0 80 6 00 Datum B Datum...

Page 11: ...0 Detail B 5 00 Detail A 1 50 0 10 0 80 0 05 3 80 2x 2 10 0 15 x64 x72 240pin DDR3 SDRAM Unbuffered DIMM Units Millimeters 1 270 0 10 4 00 N A for x64 for x72 ECC A B 47 00 71 00 133 35 9 50 128 95 2...

Page 12: ...M x64 204pin DDR3 SDRAM Unbuffered SODIMM Units Millimeters 67 60 30 00 mm nom SPD Max 3 8 1 00 0 10 20 00 mm 0 10 A B M C 2X 4 00 0 10 0 10 A B M C 2X 1 80 OPTIONAL HOLES 0 25 MAX 2 55 Detail B Detai...

Page 13: ...30 17 80 Register 1 27 0 10 4 00 max 1 0 max D8 Register D3 D2 D1 D0 D7 D6 D5 D4 Address Command and Control lines D17 D12 D11 D10 D9 D16 D15 D14 D13 1 00 0 2 0 15 2 50 0 20 Detail B 5 00 Detail A 1...

Page 14: ...15 25 6 0 15 7 45 119 29 80 78 Green Line TIM Attatch Line 0 4 1 0 0 3 0 65 0 2 R0 2 R 0 1 1 25 6 0 15 0 15 1 3 1 3 2 2 0 1 2 6 0 2 1 FRONT PART Reg pedestal line Outside Inside Green Line TIM Attatch...

Page 15: ...n size 2 5 3 6 K text mark B or K punch press_stamp 6 8 0 1 43 9 39 3 0 2 29 77 R 1 5 0 1 0 3 Upper Bending Tilting Gap 0 5 3 CLIP PART 5 8 1 05 132 95 133 45 1 27 4 DDR3 RDIMM ASS Y View Reference th...

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