ML7436N LSI Hardware Design Manual
FEXL7436NDG-01
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9.
Notes on board artworks
9.1.
GND
About IC’s back side GND pad, the number of through-hole to board GND plane should be placed more than 12. And
drawing GND line width should be more wide as much as possible to reduce GND impedance. Almost of L2 layer
should be GND plane for double-layerd board.
Figure 9.1
shows the ML7436N package figure. The IC’s back side GND PAD floats on the board. The distance is
0.25mm. Adjust the amount of solder to avoid poor soldering between IC and PCB GND.
Figure 9.1
ML7436N package figure
RF_LNA_IN1_N(#34) is GND dedicated to RF input circuit 1
st
amplifier. Connect it to input matching circuit GND in
the shortest and separate it from other GND not to mix noises.
