6
DS8241-03 January 2014
www.richtek.com
RT8241
©
Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Parameter Symbol
Test
Conditions
Min
Typ
Max
Unit
PGOOD
(upper side threshold determined by OVP threshold)
Trip Threshold
Falling edge, measured at FB,
with respect to reference, no
load.
−
19
−
15
−
11
%
Trip Hysteresis
--
3
--
%
Fault Propagation Delay
Falling edge, FB forced below
PGOOD trip threshold
-- 2.5 --
μ
s
Output Low Voltage
I
SINK
= 1mA
-- --
0.4
V
Leakage Current
High State, forced to 5V
--
--
1
μ
A
Note 1.
Stresses listed as the above
"Absolute Maximum Ratings"
may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2.
θ
JA
is measured in natural convection at T
A
= 25
°
C on a low effective thermal conductivity test board of JEDEC 51-3
thermal measurement standard.
Note 3.
Devices are ESD sensitive. Handling precaution is recommended.
Note 4.
The device is not guaranteed to function outside its operating conditions.
Note 5.
Guaranteed by Design.
