RF-Star EFR32BG22, Manual

Page: 88 / 94

EFR32BG22
www.szrfstar.com V1.6 - Jun., 2022
Shenzhen RF-star Technology Co., Ltd.
Page 87 of 93
4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5. Peak temperature: 245
℃
.
Table 6. Temperature Table of Soldering and Reflow
Profile Feature Sn-Pb Assembly Pb-Free Assembly
Solder Paste Sn63 / Pb37 Sn96.5 / Ag3.0 / Cu0.5
Min. Preheating Temperature (T
min
) 100
℃
150
℃
Max. Preheating Temperature (T
max
) 150
℃
200
℃
Preheating Time (T
min
to T
max
) (t
1
) 60 s ~ 120 s 60 s ~ 120 s
Average Ascend Rate (T
max
to T
p
) Max. 3
℃
/s Max. 3
℃
/s
Liquid Temperature (T
L
) 183
℃
217
℃
Time above Liquidus (t
L
) 60 s ~ 90 s 30 s ~ 90 s
Peak Temperature (T
p
) 220 ℃ ~ 235 ℃ 230 ℃ ~ 250 ℃
Average Descend Rate (T
p
to T
max
) Max. 6
℃
/s Max. 6
℃
/s
Time from 25 ℃ to Peak Temperature (t
2
) Max. 6 minutes Max. 8 minutes
Time of Soldering Zone (t
P
) 20 ±10 s 20 ±10 s
Figure 20. Recommended Reflow for Lead-Free Solder