QUICK EA-A10 OPERATION MANUAL
Page 9
8.2
solder flow of chip
In operation interface,select solder
Chip solder
The moving arm moves downwards
after the alignment arm back to
origin. The bottom pre-heater
comes to heat up and the TIR will
change with real time.
When the moving arm down to one
location and the temperature of TIR
up to T0, the sirocco heater of top
and bottom comes to heat.
The flow of D1~D6 finishes.
The nozzle acts upwards after into
the COOL flow, and the cool fan
comes to blow and cool the PCB.
And the time, the moving arm will
move up some distance. After the
COOL flow ends, the moving arm
will move up to top and back to
origin.
If the temperature
of the PCB still is
too higher
Is there abnormal
happens during the
process D1~D6?
press
“
STOP
”
The flow of COOL finishes.
Click “COOL FAN” key to open the cool
fan at left side.
End
Select flow
Press “
start
”
（
or press “START” in face ban
）
