UMTS/HSPA+ Module Series
UC200A-GL_Hardware_Design 69 / 79
Table 38: Recommended Thermal Profile Parameters
1. During manufacturing and soldering, or any other processes that may contact the module directly,
NEVER wipe the module’s shielding can with organi
c solvents, such as acetone, ethyl alcohol,
isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12
hours’ Neutral Salt S
pray test, the laser engraved label information on the shielding can is still clearly
identifiable and the QR code is still readable, although white rust may be found.
3. If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing into
the module.
4. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the
module.
5. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for
any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic
soldering) that is not mentioned in
Factor
Recommendation
Soak Zone
Max slope
1 to 3 °C/s
Soak time (between A and B: 150
°C
and 200
°C
)
70 to 120 s
Reflow Zone
Max slope
2 to 3 °C/s
Reflow time (D: over 217
°C
)
45 to 70 s
Max temperature
235 to 246 °C
Cooling down slope
-1.5 ~ -3 °C/s
Reflow Cycle
Max reflow cycle
1
NOTE
