UMTS/HSDPA Module
UC15 Hardware Design
UC15_Hardware_Design Confidential / Released 64 / 72
7
Storage and Manufacturing
7.1. Storage
UC15 is stored in the vacuum-sealed bag. The restriction of storage condition is shown as below.
Shelf life in sealed bag is 12 months at < 40ºC / 90%RH.
After this bag is opened, devices that will be subjected to reflow solder or other high temperature process
must be:
z
Mounted within 72 hours at factory conditions of
≤
30ºC / 60%RH.
z
Stored at <10% RH.
Devices require bake, before mounting, if:
z
Humidity indicator card is >10% when read 23ºC ± 5ºC.
z
Mounted for more than 72 hours at factory conditions of
≤
30ºC / 60% RH.
If baking is required, devices may be baked for 48 hours at 125ºC ± 5ºC.
As plastic container cannot be subjected to high temperature, Module needs to be taken out from
container to high temperature (125ºC) bake. If shorter bake times are desired, please refer to
IPC/JEDECJ-STD-033 for bake procedure.
NOTE
