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7.1.
Mechanical Dimensions of the Module.................................................................................... 31
7.2.
Recommended Footprint ......................................................................................................... 33
7.3.
Top and Bottom View of the Module ........................................................................................ 34
8
Storage, Manufacturing and Packaging .......................................................................................... 35
8.1.
Storage..................................................................................................................................... 35
8.2.
Manufacturing and Welding ..................................................................................................... 36
8.3.
Packaging ................................................................................................................................ 37
9
IC & FCC Requirement ...................................................................................................................... 39
9.1.
FCC Regulations: .................................................................................................................... 39
9.2.
RF Exposure Information ......................................................................................................... 39
9.3.
ISED Notice ............................................................................................................................. 39
9.4.
ISED Radiation Exposure Statement ...................................................................................... 40
9.5.
IMPORTANT NOTE: ................................................................................................................ 40
9.6.
USERS MANUAL OF THE END PRODUCT: .......................................................................... 40
9.7.
LABEL OF THE END PRODUCT: ........................................................................................... 41
