5G Module Series
RM500Q-AE&RM502Q-AE Hardware Design
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6.8. ESD Characteristics
The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject
to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and
packaging procedures must be applied throughout the processing, handling and operation of any
application that incorporates the module.
The following table shows the module electrostatic discharge characteristics.
Table
383837
: Electrostatic Discharge Characteristics (Temperature: 25 ºC, Humidity: 40 %)
6.9. Thermal Dissipation
RM500Q-AE&RM502Q-AE is designed to work over an extended temperature range. In order to achieve
a maximum performance while working under extended temperatures or extreme conditions (such as with
maximum power or data rate) for a long time, it is strongly recommended to add a thermal pad or other
thermally conductive compounds between the module and the main PCB for thermal dissipation.
The thermal dissipation area on the bottom (i.e. the area for adding thermal pad) is shown as below on
the below, and conductive compounds are also added on the BB, MCP, PMU, WTR, PA-1, PA-2 chips
inside the module. The dimensions are measured in mm.
Tested Interfaces
Contact Discharge
Air Discharge
Unit
VCC, GND
±5
±10
kV
Antenna Interfaces
±4
±8
kV
Other Interfaces
±0.5
±1
kV
