M10 Hardware Design
SIM_RST O SIM
reset
VOLmax=0.4V
When SIM_VDD=3V
VILmax=0.4V
When SIM_VDD=1.8V
VILmax=0.2* SIM_VDD
VOHmin=0.9*SIM_VDD
When SIM_VDD=3V
VOLmax=0.4V
When SIM_VDD=1.8V
VOLmax=0.2* SIM_VDD
Maximum cable
length 200mm
from the module
pad to SIM card
holder.
SIM_PRESE
NCE
I SIM
card
detection
VILmax=0.67V
VIHmin=1.7V
If unused , keep
pin open.
AUXADC
PIN NAME
I/O
DESCRIPTION
DC CHARACTERISTICS COMMENT
ADC0
I
General purpose analog to
digital converter.
voltage range: 0V to 2.8V
If unused keep
pin open
TEMP_BAT
I
ADC input for battery
temperature over NTC
resistor.
voltage range: 0V to 2.8V
NTC should be
installed inside
or near battery
pack to deliver
temperature
values.
If unused keep
pin open.
RF interface
PIN NAME
I/O
DESCRIPTION
DC CHARACTERISTICS COMMENT
RF_ANT
I/O
RF antenna pad.
impedance of 50
Ω
Refer
to
chapter
4
3.2 Operating modes
The table below briefly summarizes the various operating modes referred to in the following
chapters.
Table 6: Overview of operating modes
Mode
Function
Normal operation
GSM/GPRS
SLEEP
The module will automatically go into SLEEP mode if DTR is
set to high level and there is no interrupt (such as GPIO
interrupt or data on serial port).
In this case, the current consumption of module will reduce to
the minimal level.
During SLEEP mode, the module can still receive paging
M10_HD_V1.00
- 20 -
Quectel
