LTE Module Series
LTE OPEN EVB User Guide
LTE_OPEN_EVB_User_Guide 11 / 62
2.2. Key Features
The following table describes the detailed features of LTE OPEN EVB.
Table 1: Key Features of LTE OPEN EVB
Features
Implementation
Power Supply
DC power supply (J0301 or J0601): 4.5V~5.5V, typically 5.0V
VBAT (T0104)
1)
: 3.8V
LTE TE-A Interface
Support Quectel LTE-QuecOpen modules: EC2x/BG96/AG35-QuecOpen
Wi-Fi & Ethernet TE-A
Interface
Support Quectel Wi-Fi modules: FC20/AF20
eMMC Device
Manufacturer: MICRON
Part number: MTFC4GACAJCN-4M IT
SD Card Interface
Support standard SD card and TF card
SPI Flash Device
Manufacturer: GIGADEVICE
Part number: GD25LQ64CWIGR
EEPROM Device
Manufacturer: ATMEL
Part number: AT24CS64-SSHM-T
U(SIM) Interface
Support U(SIM) card insertion detection
Support U(SIM) card: 3.0V and 1.8V
Audio Interfaces
One digital audio codec board interface
Support Realteck ALC5616 and TI Codec TLV320AIC3104
Three analog interfaces used for loudspeaker, earphone and
handset
UART Interfaces
Three UART interfaces:
COM (MAIN):
Serial interface for data communication
Maximum baud rate supported: 1Mbps
2)
COM (DEBUG):
Serial interface for debugging purpose
Maximum baud rate supported: 1Mbps
2)
COM (UART1):
Serial interface for data communication
Maximum baud rate supported: 1Mbps
2)
USB Interface
Micro-B interface
Signal Indicators
4 LEDs are available for signal indication
4 LEDs are available for GPIO testing