LTE-A Module Series
EP06 Series Hardware Design
EP06_Series_Hardware_Design 50 / 56
EP06 Module
Application Board
Thermal Pad
Shielding Cover
MiniPCIe Connector
Application Board
EP06 Module
PCBA
Thermal Pad
Figure 17: Referenced Thermal Pad Design
1. Make sure that
customers’ PCB design provides sufficient cooling for the module: proper mounting,
heatsinks, and active cooling may be required depending on the integrated application.
2. In order to protect the components from damage, the thermal design should be maximally optimized
to make sure the module’s internal temperature always maintains below 105°C. Customers can
execute
AT+QTEMP
command to get the module’s internal temperature.
3. For more detailed guidelines on thermal design, refer to
document [5].
NOTES
