LTE-A Module Series
EM121R-GL Hardware Design
EM121R-GL Hardware Design 72 / 80
6.4. Electrostatic Discharge
The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject
to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and
packaging procedures must be applied throughout the processing, handling and operation of any
application that incorporates the module.
Table 49: Electrostatic Discharge Characteristics (Temperature: 25 ºC, Humidity: 40 %)
6.5. Thermal Dissipation
EM121R-GL is designed to work over an extended temperature range. To achieve a maximum
performance while working under extended temperatures or extreme conditions (such as with maximum
power or data rate) for a long time, it is strongly recommended to add a thermal pad or other thermally
conductive compounds between the module and the main PCB for thermal dissipation.
The thermal dissipation area on the bottom (i.e. the area for adding thermal pad) is shown in the following
figure. The dimensions are measured in mm.
V
IH
Input high voltage
0.7 × USIM_VDD
US 0.3 V
V
IL
Input low voltage
-0.3
0.2 × USIM_VDD V
V
OH
Output high voltage
0.8 × USIM_VDD
USIM_VDD
V
V
OL
Output low voltage
0
0.4
V
Tested Interfaces
Contact Discharge
Air Discharge
Unit
VCC, GND
±5
±10
kV
Antenna Interfaces
±4
±8
kV
Other Interfaces
±0.5
±1
kV
