LTE Standard Module Series
EG915U_Series_Hardware_Design 60 / 91
⚫
Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to
50 Ω.
⚫
The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully
connected to ground.
⚫
The distance between the RF pins and the RF connector should be as short as possible and all the
right-angle traces should be changed to curved ones. The recommended trace angle is 135°.
⚫
There should be clearance under the signal pin of the antenna connector or solder joint.
⚫
The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around
RF traces and the reference ground could help to improve RF performance. The distance between
the ground vias and RF traces should be no less than two times the width of RF signal traces (2 × W).
⚫
Keep RF traces away from interference sources, and avoid intersection and paralleling between
traces on adjacent layers.
For more details about RF layout, see
document [3]
5.2. Antenna Installation
5.2.1. Antenna Design Requirement
Table 28: Requirements for Antenna Design
Type
Requirements
GSM/LTE
VSWR: ≤ 2
Efficiency: > 30 %
Max input power: 50 W
Input impedance: 50 Ω
Cable insertion loss:
<
1 dB
:
LB
（
< 1 GHz
）
<
1.5 dB
:
MB
（
1
–2.3 GHz
）
<
2 dB
:
HB
（
> 2.3 GHz
）
5.2.2. RF Connector Recommendtion
If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector
provided by
Hirose
.
