LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 24 / 130
5. Pins 119~126 and 128 are used for SGMII interface.
6. Pins 24~27 for PCM function are multiplexing pins used for audio design on EC25 module and BT
function on FC20 module.
7. SD card, wireless connectivity and SGMII interfaces (pins 37~40, 118, 127, 129~139, 119~126, 128,
23, 28~34) are not supported on ThreadX modules.
8. Keep all RESERVED pins and unused pins unconnected.
9. GND pins 85~112 should be connected to ground in the design. RESERVED pins 73~84 should not
be designed in schematic and PCB decal, and these pins should be served as a keepout area.
3.3. Pin Description
The following tables show the pin definition of EC25 module.
Table 3: I/O Parameters Definition
Table 4: Pin Description
Type
Description
AI Analog
Input
AO Analog
Output
DI Digital
Input
DO Digital
Output
IO Bidirectional
OD Open
Drain
PI Power
Input
PO Power
Output
Power Supply
Pin Name Pin No.
I/O
Description
DC Characteristics Comment
VBAT_BB 59,
60
PI
Power supply for
module’s baseband
part
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
It must be provided with
sufficient current up to
0.8A.
