Quectel BG96, Hardware Design

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LTE Module Series
BG96 Hardware Design
BG96_Hardware_Design 7 / 78
Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 13
FIGURE 2: PIN ASSIGNMENT (TOP VIEW)..................................................................................................... 16
FIGURE 3: SLEEP MODE APPLICATION VIA UART ....................................................................................... 26
FIGURE 4: STAR STRUCTURE OF THE POWER SUPPLY............................................................................ 28
FIGURE 5: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................... 29
FIGURE 6: TURN ON THE MODULE USING KEYSTROKE ........................................................................... 29
FIGURE 7: TIMING OF TURNING ON MODULE ............................................................................................. 30
FIGURE 8: TIMING OF TURNING OFF MODULE ........................................................................................... 31
FIGURE 9: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ........................................ 32
FIGURE 10: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 32
FIGURE 11: TIMING OF RESETTING MODULE .............................................................................................. 32
FIGURE 12: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR
........................................................................................................................................................................... 34
FIGURE 13: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR . 34
FIGURE 14: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... 36
FIGURE 15: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 38
FIGURE 16: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 39
FIGURE 17: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 40
FIGURE 18: REFERENCE CIRCUIT OF THE NETWORK STATUS INDICATOR ........................................... 41
FIGURE 19: REFERENCE CIRCUIT OF STATUS ........................................................................................... 42
FIGURE 20: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 43
FIGURE 21: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................. 48
FIGURE 22: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 49
FIGURE 23: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB .................................................. 49
FIGURE 24: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE
GROUND) .......................................................................................................................................................... 49
FIGURE 25: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE
GROUND) .......................................................................................................................................................... 50
FIGURE 26: REFERENCE CIRCUIT OF GNSS ANTENNA INTERFACE ........................................................ 51
FIGURE 27: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ................................................ 53
FIGURE 28: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 53
FIGURE 29: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 54
FIGURE 30: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 63
FIGURE 31: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ................................................................. 64
FIGURE 32: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 65
FIGURE 33: RECOMMENDED STENCIL DESIGN (TOP VIEW) ..................................................................... 66
FIGURE 34: TOP VIEW OF THE MODULE ...................................................................................................... 67
FIGURE 35: BOTTOM VIEW OF THE MODULE .............................................................................................. 67
FIGURE 36: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 69
FIGURE 37: TAPE DIMENSIONS ..................................................................................................................... 70
FIGURE 38: REEL DIMENSIONS ..................................................................................................................... 70