IRDA-WELDER T-890 USER MANUAL
Http://
www.tech168.cn
13
support. Then set the PCB preheat temperature between 160 and 180
℃
and put the
temperature sensor near the sealing off component. Turn on the preheat plate for 3-5
minutes or more. You can seal off when the component is equally heated. Specially,
should turn on the upper infrared lamp to heat up, which can seal off quickly.
For the double side board, you can choose low temperature to preheat up the PCB
board and then use the upper lamp to heat up.
4. Caution and direction when sealing off/repair process:
1). When the chip with waterproof solid sealing compound, can use sol hydrosol and
other measure to sol. Pay attention to control the temperature when sealing off, In
order to prevent the temperature sensor moves that lead to the temperature
measurement isn’t exact. And the chip is heat for too long time, and the temperature
is too high leading the chip heat damaged.
2). When the chip is big, for example:computerboard,XBOX360motherboard, When
sealing off/repair big PCB board chip, for example, the computer board, XBOX360
motherboard, and so on, must certainly carry on the whole board preheat and dry, or
according to the factory technological requirement, also may depend on the
experience to process. Only then processes appropriately, can prevent effectively the
PCB board distortion and produces from this faulty soldered joint, chip rake when
sealing off/repair chip.
3). To the simple packaging chip, please pre-paste aluminized paper on the middle of
the chip avoiding to heat the chip too hot to crack. The aluminized paper size should
be a little bigger than the chip. Insure the size isn’t too big, or it will affect the result
of welding. In the sealing off/repair process, the infra-red lamp shines in the region,
