Philips Semiconductors
Product specification
TOPFET dual high side switch
BUK218-50DC
MECHANICAL DATA
Fig.4. SOT427 surface mounting package
1
, centre pin connected to mounting base.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
SOT427
0
2.5
5 mm
scale
Plastic single-ended surface mounted package (Philips version of D
2
-PAK);
7 leads (one lead cropped)
SOT427
e
e
e
e
e
e
E
b
A1
A
A1
Lp
b
c
e
A
UNIT
DIMENSIONS (mm are the original dimensions)
E
mm
4.50
4.10
1.40
1.27
0.85
0.60
0.64
0.46
2.90
2.10
HD
15.80
14.80
Q
2.60
2.20
10.30
9.70
D1
1.60
1.20
1.27
D
max.
11
1
4
7
mounting
base
D1
HD
D
Q
Lp
c
99-06-25
01-04-18
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.5 g.
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
October 2001
8
Rev 2.010
