3-2
TVN_SN
3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when
removing it.
With Soldering Iron:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
Hot-air
Flat Pack-IC
Desoldering
Machine
CBA
Flat Pack-IC
Tweezers
Masking
Tape
Fig. S-1-2
Flat Pack-IC
Desoldering Braid
Soldering Iron
Fig. S-1-3
Fine Tip
Soldering Iron
Sharp
Pin
Fig. S-1-4
Summary of Contents for 32PFL3505D/F7
Page 14: ...4 2 PL10 3DC 2 Rear Assembly S 1 1 Stand Assembly S 2 S 2 S 2 S 3 S 2 S 4 S 3 Fig D1 ...
Page 19: ...4 7 PL10 3 A01FU DC 2 Rear Assembly S 1 1 Stand Assembly S 2 S 2 S 2 S 3 S 2 S 4 S 3 Fig D1 ...
Page 58: ...10 4 PL10 3SCP2 Power Supply 2 Schematic Diagram ...
Page 59: ...10 5 PL10 3SCP3 Power Supply 3 Jack Schematic Diagram ...
Page 60: ...10 6 PL10 3SCP4 Power Supply 4 Schematic Diagram ...
Page 62: ...10 8 PL10 3SCF Function Schematic Diagram ...
Page 63: ...10 9 PL10 3SCIR IR Sensor Junction Schematic Diagram ...
