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peiker acustic GmbH & Co. KG
, Max-Planck-Straße 32, D-61381 Friedrichsdorf, Amtsgericht Bad Homburg HRA 1897
phG: peiker Verwaltungs GmbH, Vorsitzender der Geschäftsführung: Andreas Peiker, Geschäftsführer: Stephan Graf von der Schulenburg, Amtsgericht Bad Homburg 1369
Vorsitzender des Aufsichtsrates: Prof. Dr. Agilolf Lamperstorfer
Ein Unternehmen der peiker Firmengruppe
3
Overview
3.1 HW Features
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Qualcomm SoC (system on chip)
o
LTE capable modules V1140-100, V1140-101 and V1140-104
MDM9215 Baseband / PMIC8018 Power management / WTR1605L
o
Non-LTE modules
V1140-103, V1140-105 and V1140-106
MDM8215 Baseband / PMIC8018 Power management / WTR1605
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Cortex A5 Core up to 550 MHz
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3 DSPs for modem and low power audio sub systems
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RPM Resource and power manager
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2Gb NAND Flash x16,
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2Gb Low Power Mobile DDR SDRAM x32
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19.2MHz clock reference
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Dedicated heat sink in center area underneath the PCB
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GPS/GLONASS operation, GPS antenna biasing and diagnostics
3.2 Connectors
3.2.1 Module Signal and RF Connectors
The LTE-NAD has 172 signal pins (2xAA and 2xBB) connector pads with 1.0mm pitch. The signal pads
are located close to the board edges.
There are three antenna pads, each collocated by RF GND connectors
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Main transmit and receive antenna – pin LGA_PRX_ANT
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Diversity antenna for WCDMA respective MIMO antenna for LTE – pin LGA_DRX_ANT_IN
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GNSS antenna for both GPS and GLONASS – pin LGA_GPS_DRX_ANT
3.2.2 Ground and Heat Dissipation Connectors
To support the usage of module under complicated thermal conditions, there are a number of large
grounded pads in the center of PCB. These pads are dedicated ground pads to transfer heat dissipation
to a carrier board.
This should be especially considered by customer designs. A reference design showing landing patterns
and PCB stack-up is available on request.
3.3 Main Interfaces
3.3.1 USB
The NAD has one USB2.0 OTG high speed (480MBit) compliant interface including the PHY. The IF
consists of 5 signals:
