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Soldering and Desoldering (continued)
Reflow - The Rework Procedures
These procedures are quite simple really, the final actions to use the PDR Rework system but take for granted that
all other parameters have been successfully taken care of. To solder or de-solder, the procedures are as follows,
Soldering a BGA
Apply flux/Paste (A controlled amount of Gel flux is advisable and solder paste if using Column Grid Arrays or if
internal procedures demand)
Align and place component
Reflow (press ‘Start’ in the software and allow the system to complete the thermal profile)
Cool, clean (as necessary) and inspect
Soldering a QFP (or other SMDs)
Apply solder paste (or just gel flux if all pads have sufficient and flat solder mounds)
Align and place component
Reflow (press ‘Start’ in the software and allow the system to complete the thermal profile)
Cool, clean (as necessary) and inspect
Detail Procedures - Soldering
1.
De-flux and cool the PCB - remove old flux residue and generally prepare the PCB.
2.
Put PCB in jaws - and position under lens
3.
Press Align - position component target in the centre of the IR spot and adjust spotsize to be approx. 6 -10 mm
larger in area than the component area.
4.
Apply flux - to solder pads - use gel on a cooled board for best activity. If the existing solder in insufficient or has
been reworked more than once, it may be necessary to remove all old solder and replace with a good solder
paste.
5.
Place and align component onto fluxed pads (or solder paste). For fine-pitch and BGA devices use the Pick-up,
CCTV and split-beam facilities (see 'BGA Alignment' section), for standard devices look visually down and align.
6.
Move the Pick-up out of the way during the heating cycle.
7.
Press Start button - the system will automatically cycle through the Preheat, Reflow, Dwell and Cool Zones.
8.
Cool - allow the PCB/component to cool to below 160°C before moving.
Aftercare
1.
Clean flux residue off PCB if necessary
2.
Check solder joints
3.
Test