Typically the melting point is 50 - 70°F (30 - 40°C) higher. Please
use a high temperature soldering iron. In case of soldering iron
with temperature control, please set it to 700 ± 20°F (370 ± 10°C).
- Pb free solder will tend to splash when heated too high (about
1100°F/600°C).
- When soldering or unsoldering, please completely remove all of the
solder on the pins or solder area, and be sure to heat the soldering
points with the Pb free solder until it melts enough.
6. Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by electricity. Such
components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical
ES devices are integrated circuits and some field-effect transistors and semiconductor “chip”
components. The following techniques should be used to help reduce the incidence of
component damage caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or
semiconductor-equiped assembly, drain off any ESD on your body
by touching a known earth ground. Alternatively, obtain and wear
a commercially available discharging ESD wrist strap, which
should be removed for potential shock reasons prior to applying
power to the unit under test.
2. After removing an electrical assembly equiped with ES devices,
place the assembly on a conductive surface such as aluminium
foil, to prevent electrostatic charge build up or exposure of the
assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static solder remover device. Some solder
removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically
10
Summary of Contents for SA-HT800VP
Page 3: ...CD 44 1 kHz 3 ...
Page 29: ...29 ...
Page 30: ...10 5 Servo Process Flowchart 30 ...
Page 42: ...42 ...
Page 43: ...43 ...
Page 44: ...14 Disc information 44 ...
Page 45: ...45 ...
Page 52: ...16 3 Removal of Front Panel Step 1 Remove all the catches Step 2 Detach the FFC CN302 52 ...
Page 72: ...4 Restart the unloading operation to remove the cassette tape 72 ...
Page 77: ...7 Place the Input Selector 1 P C B and Input Selector 2 P C B on the Main P C B 77 ...
Page 88: ...88 ...
Page 91: ...91 ...
Page 92: ...24 1 2 Traverse Deck Mechanism Parts List 92 ...
Page 94: ...24 2 2 Cassette Mechanism Parts List 94 ...
Page 96: ...24 3 Cabinet 24 3 1 Cabinet Parts Location 96 ...
Page 97: ...24 3 2 Cabinet Parts List 97 ...
Page 102: ...QR3401 UNR521200L TRANSISTOR M 102 ...
Page 105: ...D36002 MAZ4270N0F DIODE M 105 ...
Page 142: ...142 ...
Page 143: ...FLE0306D K J N L 143 ...
Page 206: ... SIDE B DVD MODULE 1 P C B REP3406A 1N A B C D E F G 1 2 3 4 5 6 7 8 9 ...