PAN1782 Bluetooth Module
5 Cautions
Product Specification Rev. 1.0
Page 28 of 42
5
Cautions
Failure to follow the guidelines set forth in this document may result in
degrading of the module functions and damage to the module.
5.1 Design Notes
1. Follow the conditions written in this specification, especially the control signals of this
module.
2. The supply voltage should abide by the maximum ratings (
).
3. The supply voltage must be free of AC ripple voltage (for example from a battery or a low
noise regulator output). For noisy supply voltages, provide a decoupling circuit (for
example a ferrite in series connection and a bypass capacitor to ground of at least 47
µF
directly at the module).
4. This module should not be mechanically stressed when installed.
5. Keep this module away from heat. Heat is the major cause of decreasing the life time of
these modules.
6. Avoid assembly and use of the target equipment in conditions where the module
temperature may exceed the maximum tolerance.
7. Keep this module away from other high frequency circuits.
8. Refer to the recommended pattern when designing a board.
5.2 Installation Notes
1. Reflow soldering is possible twice based on the conditions set forth in
4.9 Recommended Soldering Profile.
Set up the temperature at the soldering portion
of this module according to this reflow profile.
2. Carefully position the module so that the heat will not burn into printed circuit boards or
affect other components that are susceptible to heat.
3. Carefully locate the module, to avoid an increased temperature caused by heat
generated by neighboring components.
4. If a vinyl-covered wire comes into contact with the module, the wire cover will melt and
generate toxic gas, damaging the insulation. Never allow contact between a vinyl cover
and these modules to occur.
5. This module should not be mechanically stressed or vibrated when reflowed.
6. To repair the board by hand soldering, follow the conditions set forth in this chapter.
7. Do not wash this product.
8. Pressing on parts of the metal cover or fastening objects to the metal will cause damage
to the module.
