PAN1782 Bluetooth Module
4 Specification
Product Specification Rev. 1.0
Page 27 of 42
4.9 Recommended Soldering Profile
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Reflow permissible cycles: 2
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Opposite side reflow is prohibited due to module weight
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More than 75 percent of the soldering area shall be coated by solder
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The soldering profiles should be adhered to in order to prevent electrical
or mechanical damage
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Soldering profile assumes lead-free soldering
