1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any ESD on your
body touching a known earth ground. Alternatively, obtain and
wear a commercially available discharging ESD wrist strap, which
should be removed for potential shock reasons prior to applying
power to the unit under test.
2. After removing an electrical assembly equipped with ES devices,
place the assembly on a conductive surface such as aluminum
foil, to prevent electrostatic charge buildup or exposure of the
assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an antistatic solder removal device. Some solder removal
devices not classified as "antistatic (ESD protected)" can generate
electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically
shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material to
the chassis or circuit assembly into which the device will be
installed.
CAUTION:
Be sure no power is applied to the chassis or circuit, and observe
all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement
ES devices. (Otherwise harmless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a
carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
7
Summary of Contents for OmniVision PV-Q1311
Page 9: ...Fig 1 4 Fig 1 5 9...
Page 23: ...5 2 IC TRANSISTOR AND CHIP PART INFORMATION 23...
Page 27: ...Fig D4 Fig D5 27...
Page 31: ...6 2 2 Inner Parts Location Fig J1 1 31...
Page 32: ...6 2 3 EJECT Position Confirmation Fig J1 2 32...
Page 33: ...6 2 4 Grounding Plate Unit Full Erase Head and Cylinder Unit Fig J2 1 33...
Page 84: ...84...
Page 88: ...11 2 MECHANISM BOTTOM SECTION 88...
Page 89: ...11 3 CASSETTE UP COMPARTMENT SECTION 89...
Page 90: ...11 4 CHASSIS FRAME SECTION 1 90...
Page 91: ...11 5 CHASSIS FRAME SECTION 2 91...
Page 93: ...Model PV C2011 PV C2021 PV C2031W VV 2001 PV C2061 93...
Page 111: ...R4591 ERDS2TJ681T CARBON 1 4W 680 111...
Page 113: ...R6009 ERJ6GEYJ102V MGF CHIP 1 10W 1K 113...
Page 135: ...R6032 ERJ6GEYJ102V MGF CHIP 1 10W 1K 135...