A. Do not attempt to lift the component off the board until the
component is completely disconnected from the board by a
twisting action.
B. Be careful not to break the copper foil on the printed circuit
board.
Fig. 10-1
3. Installing the leadless component
A. Presolder the contact points on the circuit board.
Fig. 10-2
B. Press the part downward with tweezers and solder both
electrodes as shown below.
Fig. 10-3
Note:
Do not glue the replacement leadless component to the circuit
board.
5.1.19. MODEL NO. IDENTIFICATION MARK
Use Marks shown in the chart below to distinguish the different models included in this Service
Manual.
22
Summary of Contents for OmniVision PV-Q1311
Page 9: ...Fig 1 4 Fig 1 5 9...
Page 23: ...5 2 IC TRANSISTOR AND CHIP PART INFORMATION 23...
Page 27: ...Fig D4 Fig D5 27...
Page 31: ...6 2 2 Inner Parts Location Fig J1 1 31...
Page 32: ...6 2 3 EJECT Position Confirmation Fig J1 2 32...
Page 33: ...6 2 4 Grounding Plate Unit Full Erase Head and Cylinder Unit Fig J2 1 33...
Page 84: ...84...
Page 88: ...11 2 MECHANISM BOTTOM SECTION 88...
Page 89: ...11 3 CASSETTE UP COMPARTMENT SECTION 89...
Page 90: ...11 4 CHASSIS FRAME SECTION 1 90...
Page 91: ...11 5 CHASSIS FRAME SECTION 2 91...
Page 93: ...Model PV C2011 PV C2021 PV C2031W VV 2001 PV C2061 93...
Page 111: ...R4591 ERDS2TJ681T CARBON 1 4W 680 111...
Page 113: ...R6009 ERJ6GEYJ102V MGF CHIP 1 10W 1K 113...
Page 135: ...R6032 ERJ6GEYJ102V MGF CHIP 1 10W 1K 135...
