Confidential
Until : Indefinite
Specifications
MN34120PAJ
Total Page
Page
96
93
2015/10/01
Generalplus Technology Inc.
Enactment Revision
Panasonic Semiconductor Solutions Co., Ltd.
3) Notes on Soldering
(1) Recommended soldering condition
Recommend
Reflow
soldering
[ Reflow soldering temperature profile ]
[ Cautions for reflow ]
a) Please keep reflow soldering
temperature. (Peak temperature (Tp) and Holding time at high temperature (tw))
(2) Recommended manual soldering condition
a) Type of soldering iron tip : D Type ( flat-blade screwdriver type )
b) Temperature of soldering iron tip :
350
C
c) Soldering time to each terminal : within 5 seconds
[ Cautions for Manual Soldering ]
a) Temperature that applies to the cover glass and the sealing area should not exceed 220
C.
b) Soldering can be carried out in any order unless temperature of the glass sealing area
exceeds 220
C.
c) Do not touch solder and soldering iron tip on the glass sealing area.
d) The soldering iron tip used must be grounded to prevent high-voltage leakage during
soldering.
(3) Limit temperature of each parts of MOS device
Based on the physical limit of materials used, the limit temperature of each part is as follows.
Parameter
Limit temperature
[ Reflow soldering ]
Limit temperature
[ Manual soldering ]
Possible damage
due to higher temperature than the limit
MOS device part
245
C
190
C
Degradation of on-chip filter and lens
Glass surface
245
C
190
C
Degradation of adhesive
Glass sealing area
245
C
225
C
Degradation of adhesive
[How to measure temperature]
(Reflow)
(4) Cautions for re-soldering
a) Please be careful when MOS device that was removed once is re-soldered because product
package may be damaged.
b) Please rework or detach the MOS device attachment parts after enough cooling time in order to
keep temperature of the parts lower than temperature indicated in the above table.
If automatic solder suction machine is used, please use the antistatic machine with temperature
control function. Also, please ground a vacuum pump to prevent surge from a motor.
(5) Cautions
This product is lead-free.
No
Sym
bol
Parameter Value
1
T1
Preheat temperature
150 ~ 180
C
2
t1
Holding time preheat
60 ~ 120 s
3
a
Temperature rising rate
1 ~ 5
C / sec
4
Tp Peak
temperature
240
C ± 5
C
5
tp
Holding time at Peak temperature
10 s ± 3 s
6
tw
Holding time at high temperature
Under 60 s
/ Over 220
C
7
b
Cooling rate
2 ~ 5
C / s
8
―
The number of reflow
One time
[℃]
120
160
140
200
220
240
180
260
220
℃
245
℃
Tp
a
b
tw
t1
T1
time
tp
Thermocouple
Mounting board
Direction of soldering
Mounting board
Thermocouple
(Manual soldering)
Direction of soldering
Mounting board
Thermocouple
(Manual soldering)