Panasonic KX-TG4011AGT, Service Manual

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KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
1 1 S Sa affe etty P y Prre ec ca au uttiio on ns s
1 1..1 1.. F Fo or S r Se errv viic ce T e Tec ech hn niic ciia an ns s
•• Repair service shall be provided in accordance with repair technology information such as service manual so as to Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be
prevent fires, injury or electric shock, which can be caused by improper repair work caused by improper repair work ..
1. 1. When repair services are provided, neither the products nor their part When repair services are provided, neither the products nor their parts or members shall be remodeled. s or members shall be remodeled.
2. 2. If a lead wire assembly is If a lead wire assembly is supplied as a repair part, t supplied as a repair part, the lead wire assembly shal he lead wire assembly shall be replaced. l be replaced.
3. 3. FAS FASTON terminals s TON terminals shall be plugged straight in and unplugged st hall be plugged straight in and unplugged straight out. raight out.
•• ICs and LSIs are ICs and LSIs are vulnerable to static electricity. vulnerable to static electricity.
When repairing, the following precautions will help prevent When repairing, the following precautions will help prevent recurring malfunctions. recurring malfunctions.
1. 1. Cover plastic Cover plastic parts boxes parts boxes with aluminum f with aluminum foil. oil.
2. 2. Groun Ground the solderin d the soldering irons. g irons.
3. 3. Use a co Use a conductive ma nductive mat on workt t on worktable. able.
4. 4. Do not grasp IC or Do not grasp IC or LSI pins with LSI pins with bare fingers. bare fingers.
2 2 W Wa arrn niin ng g
2 2..1 1.. B Ba atttte erry y C Ca au uttiio on n
1. Danger of explosion if 1. Danger of explosion if battery is incorrectly replaced. battery is incorrectly replaced.
2. Replace only with the same 2. Replace only with the same or equivalent type recommended by the manufacturer. or equivalent type recommended by the manufacturer.
3. Dispose of 3. Dispose of used batteries according to used batteries according to the manufacture’s Instructions the manufacture’s Instructions..
2. 2.2. 2. Ab Abou out L t Lea ead F d Fre ree S e Sol olde der ( r (Pb PbF: F: Pb Pb fr free ee))
Note: Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn), We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same
work we suggest using the same type of solder. type of solder.
Caution Caution
•• PbF solder PbF solder has a meltin has a melting point that i g point that is 50 s 50
°°
F ~ 70 F ~ 70
°°
F (30 F (30
°°
C ~ 40 C ~ 40
°°
C) higher than Pb solder. Please use a soldering iron with C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 temperature control and adjust it to 700
°°
F ± 20 F ± 20
°°
F (370 F (370
°°
C ± 10 C ± 10
°°
C). C).
•• Exercise c Exercise care while using hi are while using higher temperature solderi gher temperature soldering irons.: ng irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB. PCB.
•• PbF solder will tend to splash if it is heated much higher than its melting point, approximat PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 ely 1100
°°
F (600 F (600
°°
C). C).
•• When applying PbF solder to double layered boards, please check th When applying PbF solder to double layered boards, please check the component side for excess which may flo e component side for excess which may flow onto the w onto the
opposite side (See the figure below). opposite side (See the figure below).