2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the soldering
iron along the tips of the pins while feeding enough solder to the
tip so that it flows under the pins as they are heated.
28.3. Modification Procedure of Bridge
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part of the
pin to draw the solder from between the adjacent pads.
29. CABINET AND ELECTRICAL PARTS LOCATION
(BASE UNIT)
73
Summary of Contents for KX-TCD410SLS
Page 51: ...18 FREQUENCY TABLE MHz 51 ...
Page 57: ...24 CPU DATA BASE UNIT 24 1 IC2 BBIC 57 ...
Page 61: ...45 MICP A I 61 ...
Page 74: ...74 ...
Page 75: ...30 CABINET AND ELECTRICAL PARTS LOCATION HANDSET 31 ACCESSORIES AND PACKING MATERIALS 75 ...
Page 76: ...32 TERMINAL GUIDE OF THE ICs TRANSISTORS AND DIODES 32 1 Base Unit 32 2 Handset 76 ...
Page 84: ...37 1 Component View 37 2 Flow Solder Side View M KXTCD410SLS KXA141EXS 84 ...
Page 98: ...4 1 5 8 PbF 1 28 18 IC3 IC2 IC1 11 64 1 16 17 32 49 48 33 Marked ...
Page 100: ...Marked PbF IC1 IC2 100 80 5 8 4 1 50 51 30 31 1 11 18 1 28 IC3 ...
Page 102: ...Clip Base PCB G N D S D A S C L 2 7V MODE SDA SCLK GND J104 J103 J102 J101 J100 ...