(Original flux should be replaced daily.)
10.2. FLAT PACKAGE IC REMOVE PROCEDURE
1. When all of the IC lead can not been seen at the standard degree,
fill with large quantities of solder.
Note:
If you do not fill with solder and directly cut the IC lead with the cutter, stress may build up
directly in the P.C.board’s pattern. If you do not fill with large quantities of solder as in step 1
the P.C.board pattern may be removed.
2. Using a cutter, cut the lead at the source. (Cut the contents with
the cutter lightly 5 or 6 times.)
3. Remove when the solder melts. (Remove the lead at the same
time.)
34
Summary of Contents for KX-T7456 - Digital 24 Button Speakerphone Display
Page 4: ...4 DISASSEMBLY INSTRUCTIONS 4 1 HOW TO REMOVE THE LOWER CABINET Procedure 1 4 ...
Page 8: ...5 IC DATA 5 1 IC1 8 ...
Page 11: ...11 ...
Page 15: ...15 ...
Page 20: ...7 4 DATA COMMUNICATION CIRCUIT 1 Function 20 ...
Page 24: ...The reset signal is negledted 24 ...
Page 29: ...8 TROUBLESHOOTING GUIDE 8 1 NO OPERATION 8 2 THE LCD DOES NOT OPERATE 29 ...
Page 31: ...8 5 SPEAKER PHONE TROUBLE 8 6 TONE DIAL TROUBLE 8 7 TROUBLE OF OHCA 31 ...
Page 32: ...8 8 HANDSET TROUBLE 9 TERMINAL GUIDE OF ICS TRANSISTORS AND DIODES 32 ...
Page 36: ...12 CABINET AND ELECTRICAL PARTS LOCATION 13 ACCESSORIES AND PACKING MATERIALS 36 ...
Page 49: ...33 37 34 35 36 25 32 ...
Page 55: ...SW301 CN301 1 2 3 ...
Page 57: ...1 5 2 6 3 7 4 8 ...
Page 58: ...9 13 10 14 11 15 12 16 ...
Page 59: ...17 21 18 22 19 23 20 24 ...