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After removing the Flat IC and when attaching the new IC, remove any of the excess solder on
the land using the soldering wire, etc. If the excess solder is not removed from the land, the IC
will slip and not be attached properly.
10.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
1. Temporary fix FLAT PACKAGE IC by soldering on two marked
pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder using the specified solder, in the direction of the arrow, by
sliding the soldering iron.
10.4. BRIDGE MODIFICATION PROCEDURE
1. Lightly re-solder the bridged portion.
2. Remove the remaining solder along pins using a soldering iron as
shown in the figure below.
11. WAVEFORM
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Summary of Contents for KX-T7456 - Digital 24 Button Speakerphone Display
Page 4: ...4 DISASSEMBLY INSTRUCTIONS 4 1 HOW TO REMOVE THE LOWER CABINET Procedure 1 4 ...
Page 8: ...5 IC DATA 5 1 IC1 8 ...
Page 11: ...11 ...
Page 15: ...15 ...
Page 20: ...7 4 DATA COMMUNICATION CIRCUIT 1 Function 20 ...
Page 24: ...The reset signal is negledted 24 ...
Page 29: ...8 TROUBLESHOOTING GUIDE 8 1 NO OPERATION 8 2 THE LCD DOES NOT OPERATE 29 ...
Page 31: ...8 5 SPEAKER PHONE TROUBLE 8 6 TONE DIAL TROUBLE 8 7 TROUBLE OF OHCA 31 ...
Page 32: ...8 8 HANDSET TROUBLE 9 TERMINAL GUIDE OF ICS TRANSISTORS AND DIODES 32 ...
Page 36: ...12 CABINET AND ELECTRICAL PARTS LOCATION 13 ACCESSORIES AND PACKING MATERIALS 36 ...
Page 49: ...33 37 34 35 36 25 32 ...
Page 55: ...SW301 CN301 1 2 3 ...
Page 57: ...1 5 2 6 3 7 4 8 ...
Page 58: ...9 13 10 14 11 15 12 16 ...
Page 59: ...17 21 18 22 19 23 20 24 ...