7 HOW TO REPLACE FLAT PACKAGE IC
7.1. Preparation
·
SOLDER
Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19, KR-19RMA
·
Soldering iron
Recommended power consumption will be between 30 W to 40 W.
Temperature of Copper Rod 662 ± 50°F (350 ± 10°C)
(An expert may handle between 60 ~ 80 W iron, but beginner might damage foil by overheating.)
·
Flux
HI115 Specific gravity 0.863
(Original flux will be replaced daily.)
7.2. Procedure
1. Temporary fix FLAT PACKAGE IC by soldering on two marked 2 pins.
*Most important matter is accurate setting of IC to the corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder employing specified solder to direction of arrow, as sliding the soldering iron.
7.3. Modification Procedure of Bridge
1. Re-solder slightly on bridged portion.
2. Remove remained solder along pins employing soldering iron as shown in below figure.
15
KX-T2375MXW
Summary of Contents for KX-T2375MXW
Page 3: ...1 LOCATION OF CONTROLS 3 KX T2375MXW ...
Page 4: ...2 DISPLAY 4 KX T2375MXW ...
Page 16: ...8 CPU DATA 8 1 IC801 16 KX T2375MXW ...
Page 18: ...9 TERMINAL GUIDE OF IC S TRANSISTORS AND DIODES 18 KX T2375MXW ...
Page 19: ...10 BLOCK DIAGRAM KX T2375MXW 19 ...
Page 20: ...11 BLOCK DIAGRAM IC 1 11 1 Communication ICs 20 KX T2375MXW ...
Page 29: ...15 CABINET AND ELECTRICAL PARTS LOCATION 29 KX T2375MXW ...
Page 30: ...16 ACCESSORY AND PACKING MATERIALS 30 KX T2375MXW ...
Page 35: ...18 1 MEMO 35 KX T2375MXW ...
Page 38: ...38 KX T2375MXW ...
Page 39: ...41 KX T2375MXW K KXT2375MXW Printed in Japan ...