5
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as "antistatic (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION :
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
2.2.
How to Recycle the Lithium Ion Battery (U.S. Only)
Summary of Contents for HDC-HS300EB
Page 11: ...11 3 5 2 Precautions for installing HDD ...
Page 14: ...14 4 Specifications ...
Page 15: ...15 ...
Page 16: ...16 ...
Page 29: ...29 7 Disassembly and Assembly Instructions 7 1 Disassembly Flow Chart 7 2 PCB Location ...
Page 33: ...33 7 3 4 Removal of the HDD Unit Fig D5 7 3 5 Removal of the Top Case Unit Fig D6 ...
Page 38: ...38 Fig D20 7 3 15 Removal of the Monitor P C B Fig D21 Fig D22 ...
Page 39: ...39 7 3 16 Removal of the LCD Fig D23 7 3 17 Removal of the Front P C B Fig D24 ...
Page 41: ...41 Fig D27 7 3 20 Removal of the Barrier Unit and MF Ring Ornament Fig D28 ...
Page 42: ...42 7 3 21 Removal of the Flash Unit Fig D29 7 3 22 Removal of the ECM Fig D30 Fig D31 ...
Page 89: ...S 38 ...
Page 102: ...S6 3 EVF Section S 51 B45 55 B44 52 56 57 58 59 53 54 43 44 47 46 48 49 50 51 45 60 62 61 B46 ...