5
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as "antistatic (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION :
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
2.2.
How to Recycle the Lithium Ion Battery (U.S. Only)
Summary of Contents for HDC-HS100E
Page 11: ...11 3 5 2 Precautions for installing HDD ...
Page 14: ...14 4 Specifications ...
Page 15: ...15 ...
Page 16: ...16 5 Location of Controls and Components ...
Page 17: ...17 ...
Page 18: ...18 ...
Page 19: ...19 ...
Page 20: ...20 ...
Page 28: ...28 8 Disassembly and Assembly Instructions 8 1 Disassembly Flow Chart 8 2 PCB Location ...
Page 32: ...32 Fig D5 8 3 4 Removal of the HDD Unit Fig D6 ...
Page 33: ...33 8 3 5 Removal of the Top Case Unit Fig D7 8 3 6 Removal of the Front Case Unit Fig D8 ...
Page 34: ...34 8 3 7 Removal of the Battery Case Unit Fig D9 8 3 8 Removal of the Lens Unit Fig D10 ...
Page 36: ...36 8 3 12 Removal of the Flash P C B Fig D14 Fig D15 ...
Page 38: ...38 Fig D20 8 3 16 Removal of the Monitor P C B Fig D21 Fig D22 ...
Page 39: ...39 8 3 17 Removal of the LCD Fig D23 8 3 18 Removal of the Mic P C B Fig D24 ...
Page 40: ...40 8 3 19 Removal of the Barrier Motor Unit and MF Unit Fig D25 Fig D26 ...
Page 41: ...41 8 3 20 Removal of the Mic Mic Damper Fig D27 8 3 21 Removal of the Power FPC Unit Fig D28 ...
Page 45: ...45 Fig D39 8 3 30 Removal of the IRIS Unit Fig D40 Fig D41 ...
Page 79: ...S 30 ...
Page 90: ...S7 3 LCD Section S 41 158 157 154 155 156 153 B151 B152 151 159 160 152 161 162 ...