
CM602-L
Reference Manual
1.3 Equipment Specifications
Page 1-13
1.3.2 Basic Performance
Description
Item
High-speed head (12 nozzles)
High-speed head (8 nozzles)
Multi-functional head
Placement angle
0
°
to 359
°
(It can be set in increments of 0.01°.)
Placement range
See “1.4.1 Applicable Board Specifications.”
PCB flow direction
See “1.3.3 Board Flow Direction.”
Placement tact
time
∗
1
(Under optimum
conditions)
0.038 s per chip
(For 0603, 0.058 s)
0.048 s per chip
(For 0603, 0.065 s)
0.16 s per chip
(For QFP, 0.18 s)
Placement
accuracy
∗
1
∗
2
(Under optimum
conditions)
0603/1005 placement
±
0.05 mm:
Cpk
≥
1
0603/1005 placement
±
0.05 mm:
Cpk
≥
1
QFP placement
±
0.035 mm:
Cpk
≥
1
Target
component
Component dimensions
0603 chip to 5 mm
×
5 mm
(7.3 mm or less diagonally)
Component thickness
6.5 mm maximum
Component dimensions
0603 chip to 24 mm
×
24 mm
Component thickness
6.5 mm maximum
Component dimensions
0603 chip to 100 mm
×
90 mm
Component thickness
21 mm maximum
Mass
30
g
maximum
Board
changing time
0.9 s (Board size: L 240 mm
×
W 240 mm or under)
1.8 s (Board size: L 240 mm
×
W 240 mm to L 330 mm
×
W 330 mm)
2.3 s (Board size: L 330 mm
×
W 330 mm to L 510 mm
×
W 460 mm)
∗
1 : The values may vary with the type of component.
∗
2 : It is the case where the placement angle is 0
°
, 90
°
, 180
°
, or 270
°
.
The values vary in the case of
the other angles.
They may be affected by rapid changes in ambient temperature.
EJM4A-E-RMA01-A01-01