Panametrics DigitalFlow XMT868i, Service Manual

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DigitalFlow™ XMT868i Service Manual 7
Chapter 4. Parts Replacement
4.6.1 Attaching an Optional Heat Sink to an I/O Option Card
If you need to attach an optional heat sink to an I/O option card (the TI, TR, FI or FR options in Appendix B of the Startup
Guide) , refer to Illustration 9 in Figure 9 on page 13 and complete the following steps:
1. Orient the thermal heat pad(s) to the heat sink as shown in Figure 9 on page 13 and apply it to the heat sink.
2. Loosely attach the aluminum backplate to the I/O heat sink with three screws, lock washers and flat washers.
Note: The following step applies only to the TR and FR option cards. Otherwise, proceed to step 4.
3. If you have an optional heat sink bridge, attach it to the I/O heat sink with two screws, lock washers, flat washers
and nuts.
4. Attach the assembled heat sink by straddling the power supply components on the option card with the
aluminum plate to the left (inside) and the heat sink to the right (outside).
5. Tighten the three screws (step 2) to secure the aluminum backplate to the heat sink.
Complete the option card installation by proceeding to Assembling the Circuit Board Assembly on page 8.