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PICO 155P Precision Saw
I
NSTRUCTION
M
ANUAL
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3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: [email protected] Web: http://www.metallographic.com
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
9.0 Precision Wafer Sectioning
9.1a Precision Wafer Sectioning Introduction
Precision wafer cutting is used for sectioning very delicate samples or sectioning a sample to
a very precise location. Precision wafering saws typically have micrometers for precise
alignment and positioning of the sample as well as variable loading and cutting speed control
(see Figure 9-1).
Figure 9-1 PICO 155P
Precision wafering saw
9.1b Wafering Blade Characteristics
In order to minimize cutting damage, precision wafer cutting most frequently uses diamond
wafering blades. However, for some materials, the use of cubic boron nitride (CBN) is more
efficient. In addition, optimal wafer cutting is accomplished by maximizing the abrasive
concentration and abrasive size, as well as choosing the most appropriate cutting speed and
load. Table III provides some general guidelines and parameters for precision-sectioning a
variety of materials.
The particle size of fine diamond grit blades is 10-20 microns or approximately 600 grit. For
medium grit diamond wafering blades, the particle size is 60-70 micron or 220 grit. For these
types of wafering blades, the abrasive is mixed with a metal binder and then pressed under
high pressure (Figure 9-2). As will be discussed in the next section, periodic dressing /
conditioning of the metal pressed blades is required for optimum cutting performance of the
blade.
