EVBUM2822/D
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Figure 15. EVB Bode Plots @ 300 W; 115 V on Top; 230 V on Bottom
Thermal Performance
The NCP1680 EVB and daughter card where also
evaluated for thermal performance while operating at
90 V
AC
and 300 W. Thermal images of the fast leg GaN
HEMTs, the boost inductor, and the slow leg silicon FETs
are shown in Figure 16. These images were captured in
a 25
°
C ambient environment with no external air flow. The
high efficiency performance of the TPFC is evident in the
device temperatures where the fast and slow leg switches
measure below 60
°
C, a modest 35
°
C rise above room
temperature. The daughter card PCB is also designed in
a manner that eliminates the need for an additional heatsink
to be mounted to the board. The PCB’s internal copper
planes function as heat sinking and the temperature rise of
the fast leg switches is well controlled by these copper
planes.
Figure 16. Thermal Measurement of Fast Leg eGaN Switches, Boost Inductor, and Slow leg Si FETs
Summary of Contents for NCP1680
Page 12: ...EVBUM2822 D www onsemi com 12 MOTHERBOARD PCB ARTWORK Figure 17 Motherboard PCB Part 1 3...
Page 15: ...EVBUM2822 D www onsemi com 15 DAUGHTERBOARD PCB ARTWORK Figure 20 Daughterboard PCB Part 1 2...
Page 17: ...EVBUM2822 D www onsemi com 17 TRANSFORMER DATA SHEET Figure 22 Transformer Data Sheet...
Page 19: ...EVBUM2822 D www onsemi com 19 Daughter Card Figure 25 Daughter Card...
