ON Semiconductor NCS36000, Operating Manual

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NCS36000
www.onsemi.com
2
PIN FUNCTION DESCRIPTION
Pin No. Pin Name Description
1 OP2_O Output of second amplifier
2 OP2_N Inverting input of second amplifier
3 OP1_O Output of first amplifier
4 OP1_N Inverting input of first amplifier
5 OP1_P Non−inverting input of first amplifier
6 VREF Regulated voltage reference to drive sensor
7 VSS Analog ground reference.
8 OUT CMOS output (10 mA Max)
9 LED CMOS output to drive LED (10mA Max)
10 xLED_EN Active low LED enable input
11 NC No Connect
12 MODE Pin used to select pulse count mode
13 OSC External oscillator to control clock frequency
14 VDD Analog power supply
ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage Range (Note 1) V
in
−0.3 to 6.0 V
Output Voltage Range V
out
−0.3 to 6.0 V or (V
in
+ 0.3),
whichever is lower
V
Maximum Junction Temperature T
J(max)
140
°
C
Storage Temperature Range T
STG
−65 to 150
°
C
ESD Capability, Human Body Model (Note 2) ESD
HBM
2 kV
ESD Capability, Machine Model (Note 2) ESD
MM
200 V
Lead Temperature Soldering
Reflow (SMD Styles Only), Pb−Free Versions (Note 3)
T
SLD
260
°
C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating:
v
150 mA per JEDEC standard: JESD78
3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Characteristics, DFN6, 3x3.3 mm (Note 4)
Thermal Resistance, Junction−to−Air (Note 5)
Thermal Reference, Junction−to−Lead2 (Note 5)
R
q
JA
R
Y
JL
Will be Completed once
package and power
consumption is finalized
°
C/W
Thermal Characteristics, TSOP−5 (Note 4)
Thermal Resistance, Junction−to−Air (Note 5) R
q
JA
See note above.
°
C/W
4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
5. Values based on copper area of 645 mm
2
(or 1 in
2
) of 1 oz copper thickness and FR4 PCB substrate .