EVBUM2528/D
www.onsemi.com
5
Table 1. BILL OF MATERIALS
Item
Pkg Type
Manufacturer
Description
Part Number
Value
Reference
Qty
13
1
R2
113k
RC0402FR
−
07200KL
RES, SMD, 1/16 W
STD
402
14
1
R3
3.01
RMCF0805FT3R01
RES, SMD,
1/8
W
STD
805
15
1
R4
1
RMCF0805FT1R00
RES, SMD,
1/8
W
STD
805
16
3
R6
−
8
DNI
RES, SMD, 1/10 W
STD
603
17
1
R11
4.99k
RC0805FR
−
074K99L
RES, SMD,
1/8
W
STD
805
18
1
R12
10k
RC0805FR
−
0710KL
RES, SMD, 1/8 W
STD
805
19
1
U1
NCP51705
SiC Driver, Single, 6 A,
Single
ON
Semiconductor
WQFN
−
24
20
1
U2
ADuM142E1WBRQZ
Digital Isolator, RF, 4
−
Chan-
nel
Analog
Devices
QSOP
−
16
PCB Assembly and Layers
Figure 4 through Figure 9 shows the top and bottom
assembly and the four
−
layers of the PCB. The PCB is 35 mm
x 15 mm x 5 mm (length x width x height) where the width
of the PCB is approximately the width of a T0
−
247 body.
Figure 4. Top Assembly
Figure 5. Bottom Assembly