EZAIRO 7160 SL HYBRID
15
Figure 6. Frequency Response Graph
RSL10 Architecture Overview
Information on the RSL10 architecture can be found on
the RSL10 datasheet available on
Chip Identification
System identification is used to identify different system
components.
For the Ezairo 7100, this information can be retrieved
using the Promira
t
Serial Platform from TotalPhase, Inc. or
the Communications Accelerator Adaptor (CAA) with the
protocol software provided by ON Semiconductor. The key
identifier components and values are as follows:
•
Chip Family: 0x06
•
Chip Version: 0x01
•
Chip Revision: 0x0200
For the RSL10 chip, the key identifier components and
values are as follows:
•
Chip Family: 0x09
•
Chip Version: 0x01
•
Chip Revision: 0x01
The hybrid ID can be found in the manufacturing area of
the EEPROM at address 0x00F1 to 0x00F2 (2 bytes => 16
bits).Similar to the Ezairo 7100 information, the hybrid ID
can be retrieved using a programming interface.
•
Hybrid ID:
−
0x03C0
−
0x13C0 (for usage with special audio protocol. Please
contact your ON Semiconductor representative for
more information)
Solder Information
The Ezairo 7160 SL hybrid is constructed with RoHS
compliant material with bump metallization of SAC305
(Sn96.5/Ag3.0/Cu0.5) solder.
This device is moisture sensitive, J
−
STD
−
020 Class
MSL4, with peak soldering temperature of 240
°
C. For
necessary storage, handling, and soldering instruction,
please refer to the soldering and mounting techniques
reference manual (SOLDERM/D, available on line),
Chapter: How to Store, Reflow and Solder
ON Semiconductor Hybrids.
The furnace profile shown in Figure 7 was used to confirm
the device compatibility with lead free reflow. Note: The
maximum component body reflow temperature for this
device is 240
°
C.
