MT-MR PLATINUM. POINT TO POINT AURAL RADIO RELAY SYSTEM
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GENERAL SAFETY RECOMMENDATIONS
When connecting any OMB equipment to the Mains power , please follow these important recommendations:
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This product is intended to operate from a power source that will not apply more than 10% of the voltage
specified on the rear panel between the supply conductors or between either supply conductor and ground.
A protective-ground connection by way of the grounding conductor in the power cord is essential for safe
operation.
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This equipment is also grounded through the grounding conductor of the power cord. To avoid electrical
shock, plug the power cord into a properly wired socket before connecting to the product input or output
terminals.
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Upon loss of the protective-ground connection, all accessible conductive parts (including parts that may
appear to be insulating) can render an electric shock.
Equipment must be throughly connected to Station's
ground system before any attempt to connect it to Mains electrical supply.
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To avoid fire hazard, use only the fuses of correct type, voltage rating, and current rating. Refer fuse
replacement to Technical Manual and qualified service personnel.
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To avoid explosion, do not operate this equipment in an explosive atmosphere.
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To avoid personal injury, do not remove the product covers or panels. Do not operate the product without
the covers and panels properly installed.
GOOD PRACTICES
In maintaining the equipment covered in this Manual, please keep in mind the following, standard good practices:
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When connecting any instrument (wattmeter, spectrum analyzer, etc.) to a high frequency output, use the
appropriate attenuator or dummy load to protect the final amplifiers and the instrument input.
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When inserting or removing printed circuit boards (PCBs), cable connectors, or fuses, always turn off power to
the affected portion of the equipment. After power is removed, allow sufficient time for the power supplies to
bleed down before reinserting PCBs.
Always use discharge stick when available.
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When troubleshooting, remember that FETs and other metal-oxide semiconductor (MOS) devices may appear
defective because of leakage between traces or component leads on the printed circuit board. Clean the printed
circuit board and recheck the MOS device before assuming it is defective.
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When replacing MOS devices, follow standard practices to avoid damage caused by static charges and
soldering.
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When removing components from PCBs (particularly ICs), use care to avoid damaging PCB traces.
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