NXP Semiconductors i.MX 8M Plus LPDDR4 EVK, Hardware User'S Manual, Page: 19 / 20

Table 10. 8MPLUS-BB Board stack up information (continued)
Layer Description Copper (Oz.) Generic Er Dielectric thickness (mil)
2 GND 1
Dielectric Core 0.1MM 1/1 4.13 3.94 mil
3 Signal 1
Dielectric
7628 RC47%
2116 RC58% 4.2
3.91
12.88 mil
4 Power 1
Dielectric Core 0.3MM 1/1 4.47 11.81 mil
5 Power 1
Dielectric
2116 RC58%
7628 RC47% 3.91
4.2
12.7 mil
6 Signal 1
Dielectric Core 0.1MM 1/1 4.13 3.94 mil
7 GND 1
Dielectric 1080 RC64% 3.75 2.96 mil
8 Signal 0.5+Plating 1.31 mil
Finished: 62.992(+6.299/-6.299) mil 1.6(+0.16/-0.16) MM
Designed: 61.01 mil 1.55 MM
Material: TU768
3.1 EVK design files
You can download the schematics, layout files, gerber files, and BOM from 8MPLUSLPD4-EVK .
NXP Semiconductors
PCB information
i.MX 8M Plus LPDDR4 EVK Board Hardware User's Guide, Rev. 0, March 9, 2021
User's Guide 19 / 20