NXP Semiconductors i.MX 8M Plus LPDDR4 EVK, Hardware User'S Manual, Page: 18 / 20

Chapter 3
PCB information
The i.MX 8M Plus LPDDR4 EVK is composed by 8MPLUSLPD4-CPU and 8MPLUS-BB. Table 1 lists the dimensions of the two
boards. The CPU board is made with standard 6-layer technology and the BB board is made with 8-layer technology. The material
is FR-4, and the PCB stack-up information is shown in
Table 9 and Table 10 .
Table 9. 8MPLUSLPD4-CPU Board stack up information
Layer Description Copper (Oz.) Generic Er Dielectric thickness (mil)
1 Signal 0.33+Plating 1.15 mil
Dielectric 1067 RC74% 3.49 2.5 mil
2 GND 1
Dielectric Core 0.075MM 1/1 3.97 2.95 mil
3 Signal 1
Dielectric
7628 RC49%
2116 RC54%
2116 RC54%
7628 RC49% 4.15
4.01
4.01
4.15
26.4 mil
4 Power 1
Dielectric Core 0.075MM 1/1 3.97 2.95 mil
5 GND 1
Dielectric 1067 RC74% 3.49 2.5 mil
6 Signal 0.33+Plating 1.15 mil
Finished: 47.244 (4.724/-4.724) mil 1.2 (+0.12/-0.12) MM
Designed: 45.5 mil 1.156 MM
Material: TU768
Table 10. 8MPLUS-BB Board stack up information
Layer Description Copper (Oz.) Generic Er Dielectric thickness (mil)
1 Signal 0.5+Plating 1.31 mil
Dielectric 1080 RC64% 3.75 2.96 mil
Table continues on the next page...
NXP Semiconductors
i.MX 8M Plus LPDDR4 EVK Board Hardware User's Guide, Rev. 0, March 9, 2021
User's Guide 18 / 20