NXP Semiconductors FRDM-HB2001-EVM, User Manual, Page: 28 / 31

Accessory item Bill of Materials
FRDM-HB2001-EVM evaluation board , Rev. 1.0
28 NXP Semiconductors
9 Accessory item Bill of Materials
Switches, Connectors, Jumpers and Test Points
21 16
IN1, GND1,IN2, GND2,
GND3, VPWR, VDDQ,
VDD,SCLK, MOSI,
MISO, GND,FS_B,
ENBL, DIS, CS_B
TEST POINT BLACK 40 MIL DRILL
180 MIL TH 109L
5001
22 11
J1, J2, J3, J4, J5, J6, J7,
J8, J14, J17
HDR 1X3 TH 100 MIL SP 374H AU 826629-3
23 1 J10
HDR 2X10 TH 100 MIL CTR 330H AU
100L
TSW-110-07-S-D
24 4 J11, J15, J18, J19, J26
HDR 1X2 TH 100 MIL SP 378H AU
130L
826629-2
25 2 J20, J21
CON 1X2 TB TH 5.08 MM 543H SN
138L
20020316-H021B01LF
26 1 J23 HDR 2X6 TH 100 MIL CTR 330H AU TSW-106-07-S-D
27 2 J24, J25 HDR 2X8 TH 100 MIL CTR 330H AU TSW-108-07-G-D
28 1 Q1
TRAN NMOS PWR 30 A 55 V
AEC-Q101 TO252
IPD30N06S2-15
29 1 Q3
TRAN NPN DRIVER 500 mA 80 V
AEC-Q101 SOT23
SMMBTA06LT1G
Notes
1. NXP does not assume liability, endorse, or warrant components from external manufacturers are referenced in circuit drawings or tables. While
NXP offers component recommendations in this configuration, it is the customer’s responsibility to validate their application.
2. Critical components. For critical components, it is vital to use the manufacturer listed.
Table 13. Bill of Materials
(3)
Item Qty Part Number Description
1 1 FRDM-KL25Z NXP Freedom Development Platform for Kinetis KL14/15/24/25 MCUs
Notes
3. NXP does not assume liability, endorse, or warrant components from external manufacturers are referenced in circuit drawings or tables. While
NXP offers component recommendations in this configuration, it is the customer’s responsibility to validate their application.
Table 12. Bill of Materials
(1)
(continued)
Item Qty Schematic Label Value Value/Description Part Number
Assy
Opt