NXP Semiconductors A3M38SL039, Manual

Page: 2 / 33

A3M38SL039 Airfast Power Amplifier Module with Autobias Control, Rev. 0, September 2022
Data Sheet: Technical Data 2 / 33
Contents
1 Pinout configuration and function .................. 3
1.1 Pin connections ............................................... 3
1.2 Functional pin description ................................ 4
2 Electrical characteristics .................................. 4
2.1 Ratings ............................................................ 4
2.1.1 Maximum ratings ............................................. 4
2.1.2 Lifetime ............................................................ 5
2.1.3 ESD protection characteristics ........................ 5
2.1.4 Moisture sensitivity level .................................. 5
2.2 Operating characteristics ................................. 5
2.2.1 Nominal DAC settings ..................................... 5
2.2.2 Functional tests ............................................... 6
2.2.3 Wideband ruggedness .................................... 6
2.2.4 Typical performance ........................................ 6
3 Register map and OTP memory ....................... 7
3.1 One-time programmable memory.................... 7
3.2 Register map ................................................... 7
4 Power supply sequence ................................. 10
5 Autobias functionality .................................... 11
5.1 General overview .......................................... 11
5.2 Operational overview..................................... 11
5.3 Tx enable control ........................................... 12
5.4 Sense_DAC .................................................. 12
5.5 VGS_DAC ..................................................... 13
5.6 Engineering Mode (EM) ................................ 13
6 Ordering information ...................................... 13
7 Component layout and parts list ................... 14
7.1 Component layout ......................................... 14
7.2 Component designations and values ............ 15
8 Temperature sensor ....................................... 15
9 Communication interfaces ............................. 16
9.1 SPI ................................................................ 16
9.1.1 SPI timing diagram ........................................ 16
9.1.2 SPI instruction set definition .......................... 16
9.2 I
2
C ................................................................. 17
9.2.1 I 2 C addressing ............................................... 17
9.2.2 I
2
C instruction set .......................................... 18
9.2.3 I 2 C Device ID Read instruction ...................... 19
9.3 I
2
C electrical specification and timing for I/O
stages and bus lines ..................................... 20
9.3.1 I
2
C SCLK and SDA characteristics ................ 21
9.3.2 I 2 C bus electrical characteristics ................... 22
10 Design considerations ................................... 22
10.1 Power on sequence ...................................... 22
10.2 Programming guidelines to avoid hardware
failure or damage .......................................... 23
10.3 Group programming ...................................... 23
11 Product marking ............................................. 25
12 Package information....................................... 26
13 Product software and tools ............................ 32
14 Failure analysis ............................................... 32
15 Revision history .............................................. 32