Nokia 9000i, Service Manual

Page: 32 / 434

After Sales
Technical Documentation
RAE/RAK–1N
Baseband
Page 2–6
Original, 08/96
The MCM 2 contains the 6 ICs in DSPU, AUDIO, ASIC and RFI
submodules plus bypass capacitors and some resistors. The PWRU
module is laid out in the CMT board using conventional SMD assembly.
The rest of the functional modules are partly packaged in the MCM’s and
partly SMD assembled on the CMT board. In the latter description of the
modules the functional partitioning will be used.
Table 2. List of Physical Submodules
Name of submodule Function
MCM1 Contains MCU, SCL, 2xFLASH, 2xSRAM and EEPROM
MCM2 Contains DSP, 2xSRAM, ASIC, RFI and CODEC
Interconnection Diagram
DSP
PCM
CODEC
512K x 16
FLASH 64K x 16
SRAM
A(4:0),
A(19:16),
D(15:8)
A(16:1),
D(15:0)
ext
mem
ear
mic
sio
E
2
PROM
8K X 8
PSL+
CHRGR
RBUS
sio
MCU
12 bit pa
8 x control
A(17:1),
D(15:0)
A(19:0),D(15:0)
A(5:0),
D(15:0)
A(12:0),
D(15:8)
sio
sio
DBUS
32K x 16
SRAM
A(14:0),
D(15:0)
ASIC
io ext mem
sio
RFI RF
io
extear
extmic
PHFmic
MCM1
MCM2
SCL
A(19:13)
FA(19:17)
FLASH
CS SRAM
CS EEPROM
CS
io
PHFear
amp_pwr
MBUS
UIF controls
SIM controls sio
pio
page
sel.
MBUS TX
routed via SCL
Figure 1. Interconnection diagram