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SK-9
LGA rework kit for
MicroPA
0274819
SK-9 is used to print solder paste on MicroPA component (NMP code:
4355641) when the component is reworked.
SK-9 consists of ST-13 (NMP code: 0770848) stencil and RJ-21 (NMP code:
0770849) rework jig.
Due to the large mechanical tolerance of the component, the following
procedure is necessary:
Instructions
1 Put the component into the rework jig. The component should be
placed in the best fit location which is determined by placing the
component in the largest location first, and if this is too large, re-
position it to the next location. This should be carried out until the
best fit location is found.
2 Once the best fit location has been found, leave the component there
and put the stencil on top of the jig and the component.
3 Put soldering paste on the component properly.
4 Remove the stencil and the component from the jig.
5 Start the soldering process.
Spare part for SF-27
Test pin module
0780357
Spare part module
(LCD-UIB PWB)
0780356
Spare part for SF-27
Test pins
0770754
Soldering required
Spare part module
(KeyPad-UIB PWB)
0780355
RM-25
Nokia Customer Care
Service tools
Page 4–14
Company Confidential
9235618 (Issue 2)
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